Electronic device including flexible display

ABSTRACT

An electronic device includes a first housing; a second housing configured to be sliding relative to the first housing; a flexible display, wherein at least part of the flexible display is supported by the second housing and a size of the flexible display viewable from a front surface of the electronic device changes in accordance with a sliding of the second housing; a guide member configured to operatively connect at least part of the first housing and at least part of the second housing for the sliding of the second housing; and a conductive layer disposed between a portion of the second housing and the flexible display, wherein the second housing includes a first support portion supporting a first portion of the flexible display; and a second support portion supporting a second portion of the flexible display and allowing the second portion of the flexible display to be bent, and wherein the conductive layer is configured to electrically connect at least a part of the flexible display and the second support portion.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a Continuation Application of U.S. patentapplication Ser. No. 17,527,468, filed on Nov. 16, 2021, in the U.S.Patent and Trademark Office, which is a Continuation application of U.S.patent application Ser. No. 17/330,904, filed on May 26, 2021, issued asU.S. Pat. No. 11,204,629 on Dec. 21, 2021, and is based on and claimspriority under 35 U.S.C. § 119 to Korean Patent Application No.10-2020-0125692, filed on Sep. 28, 2020, in the Korean IntellectualProperty Office, the disclosure of each of which is incorporated byreference herein in its entirety.

BACKGROUND 1. Field

The disclosure relates generally to an electronic device including aflexible display.

2. Description of Related Art

An electronic device may include a flexible display and may expand adisplay area visually exposed on the exterior of the electronic device.For example, the flexible display may be disposed in a curved, foldable,or rollable form in the electronic device.

Various forms of electronic devices have been developed to ensure anexpanded display area without affecting portability. For example,electronic devices may include a slide type electronic device in which afirst structure (e.g., a first housing) and a second structure (e.g., asecond housing) slide relative to each other or a foldable typeelectronic device in which a first housing and a second housing aredisposed to be folded or unfolded.

In the case of the slide type electronic device among the various formsof electronic devices, a display area exposed on a front surface of theelectronic device may be expanded as a flexible display is withdrawn bysliding of the first structure (e.g., the first housing) and the secondstructure (e.g., the second housing). For example, at least part of theflexible display may be disposed to face toward a rear surface of theelectronic device as the flexible display is rolled in a state in whichthe first structure and the second structure are closed and overlap eachother.

However, when switching states, the electronic device may experienceinfiltration of foreign matter into the electronic device, which maydegrade the quality of the electronic device over time. In addition,various sliding designs may experience noise and interference amongcomponents of the electronic device.

SUMMARY

The present disclosure has been made to address the above-mentionedproblems and disadvantages, and to provide at least the advantagesdescribed below.

In accordance with an aspect of the disclosure, an electronic deviceincludes a first housing; a second housing configured to be slidingrelative to the first housing; a flexible display, wherein at least partof the flexible display is supported by the second housing and a size ofthe flexible display viewable from a front surface of the electronicdevice changes in accordance with a sliding of the second housing; aguide member configured to operatively connect at least part of thefirst housing and at least part of the second housing for the sliding ofthe second housing; and a conductive layer disposed between a portion ofthe second housing and the flexible display, wherein the second housingincludes a first support portion supporting a first portion of theflexible display; and a second support portion supporting a secondportion of the flexible display and allowing the second portion of theflexible display to be bent, and wherein the conductive layer isconfigured to electrically connect at least a part of the flexibledisplay and the second support portion.

In accordance with another aspect of the disclosure, a first housing; asecond housing slidably connected to the first housing; a flexibledisplay supported by the first housing and the second housing; a rollerdisposed on one side of the first housing so as to be rotatable, a belthaving opposite end portions connected to the second housing, and aconductive layer disposed between a portion of the second housing andthe flexible display; wherein the second housing includes a plurality ofprotrusions forming a multi joint structure, and wherein the conductivelayer is configured to electrically connect at least a part of theflexible display and the plurality of protrusions.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the disclosure will be more apparent from the followingdescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a view illustrating a first state of an electronic device,according to an embodiment;

FIG. 2 is a view illustrating a second state of the electronic device,according to an embodiment;

FIG. 3 is an exploded perspective view of the electronic device,according to an embodiment;

FIG. 4A is a sectional view of the electronic device, according to anembodiment;

FIG. 4B is a sectional view of the electronic device, according to anembodiment;

FIG. 5 illustrates a first structure, a second structure, and conductivestructures of the electronic device, according to an embodiment; f

FIG. 6 illustrates the first structure, the second structure, andconductive structures of the electronic device, according to anembodiment;

FIG. 7A illustrates an operation in which the conductive structures makecontact with each other in the first state of the electronic device,according to an embodiment;

FIG. 7B illustrates an operation in which the conductive structures makecontact with each other in the second state of the electronic device,according to an embodiment;

FIG. 8A illustrates an operation in which the conductive structures makecontact with each other in the first state of the electronic device,according to an embodiment;

FIG. 8B illustrates an operation in which the conductive structures makecontact with each other in the second state of the electronic device,according to an embodiment;

FIG. 9A illustrates an operation in which the conductive structures makecontact with each other in the first state of the electronic device,according to an embodiment;

FIG. 9B illustrates an operation in which the conductive structures makecontact with each other in the second state of the electronic device,according to an embodiment;

FIG. 10A illustrates an operation in which the conductive structuresmake contact with each other in the first state of the electronicdevice, according to an embodiment;

FIG. 10B illustrates an operation in which the conductive structuresmake contact with each other in the second state of the electronicdevice, according to an embodiment;

FIG. 11 illustrates an electrical contact structure of a display of theelectronic device and a second support portion of the second structure,according to an embodiment;

FIG. 12 illustrates a display of an electronic device, according to anembodiment;

FIG. 13 illustrates a second structure and the display of the electronicdevice, according to an embodiment;

FIG. 14 illustrates an electrical connection structure of a display anda circuit board of an electronic device, according to an embodiment;

FIG. 15A illustrates the electrical connection structure of the displayand the circuit board of the electronic device, according to anembodiment;

FIG. 15B illustrates the electrical connection structure of the displayand the circuit board of the electronic device, according to anembodiment; and

FIG. 16 is a block diagram of an electronic device in a networkenvironment according to an embodiment.

DETAILED DESCRIPTION

Various embodiments of the disclosure are described with reference tothe accompanying drawings. However, various embodiments of thedisclosure are not limited to particular embodiments, and it should beunderstood that modifications, equivalents, and/or alternatives of theembodiments described herein can be variously made. With regard todescription of drawings, similar components may be marked by similarreference numerals.

One aspect of the disclosure is to provide an electronic deviceincluding a conductive structure for ground contact of a first structureand a second structure when the electronic device is in an open stateand a closed state.

FIG. 1 is a view illustrating a first state of an electronic device,according to an embodiment. FIG. 2 is a view illustrating a second stateof the electronic device, according to an embodiment.

FIG. 1 is a view illustrating a front surface and a rear surface of theelectronic device when the electronic device is in the first state. FIG.2 is a view illustrating the front surface and the rear surface of theelectronic device when the electronic device is in the second state.

Referring to FIGS. 1 and 2 , the electronic device 100 includes a case110, a second structure 140, and a display 150. The electronic device100 may be in the first state (e.g., the state of FIG. 1 ) or the secondstate (e.g., the state of FIG. 2 ). For example, the first state and thesecond state of the electronic device 100 may be determined depending onthe position of the second structure 140 relative to the case 110, andthe electronic device 100 may be configured to be changed between thefirst state and the second state by a user operation or a mechanicaloperation.

The first state of the electronic device 100 may refer to a closed statein which at least part (e.g., a first peripheral portion 143) of thesecond structure 140 makes contact with the case 110. The second stateof the electronic device 100 may refer to an open state in which the atleast part (e.g., the first peripheral portion 143) of the secondstructure 140 is spaced apart from the case 110. The state in which part(e.g., a second peripheral portion 144 or a third peripheral portion145) of the second structure 140 is inserted into a side member 110-1 or110-2 of the case 110 as illustrated in FIG. 1 may be defined as thefirst state. The state in which the part (e.g., the second peripheralportion 144 or the third peripheral portion 145) of the second structure140 is withdrawn from the side member 110-1 or 110-2 of the case 110 asillustrated in FIG. 2 may be defined as the second state.

The surface facing substantially the same direction as at least part(e.g., a first region 151) of the display 150 included in the electronicdevice 100 may be defined as the front surface of the electronic device100, and the surface facing away from the front surface may be definedas the rear surface of the electronic device 100. The front surface ofthe electronic device 100 may refer to surfaces that form the exteriorof the electronic device 100 when the electronic device 100 is viewed ina direction perpendicular to part (e.g., the first region 151) of thedisplay 150 that is included in the electronic device 100 (or, locatedon the exterior of the electronic device 100). The rear surface of theelectronic device 100 may refer to surfaces that form the exterior ofthe electronic device 100 when the electronic device 100 is viewed in adirection perpendicular to a back cover 110-4 (or, a rear member). Theouter surface of the electronic device 100 that substantially faces the+Z-axis direction may be construed as the front surface of theelectronic device 100, and the outer surface of the electronic device100 that substantially faces the −Z-axis direction may be construed asthe rear surface of the electronic device 100.

The case 110 may form at least part of the exterior of the electronicdevice 100. The electronic device 100 may be changed to the first stateand the second state as the second structure 140 and the display 150slide relative to the case 110 in both directions (e.g., a firstdirection D1 and a second direction D2).

The case 110 may include the first side member 110-1, the second sidemember 110-2, and rear members 110-3 and 110-4. The first side member110-1 and the second side member 110-2 may be disposed to face eachother in a direction substantially perpendicular to the directions inwhich the second structure 140 slides. The rear members 110-3 and 110-4may include the frame 110-3 and the back cover 110-4. The rear members110-3 and 110-4 may be disposed between the first side member 110-1 andthe second side member 110-2 and may be connected to the first sidemember 110-1 and the second side member 110-2. For example, one endportion (e.g., an end portion facing the +Y-axis direction) of each ofthe rear members 110-3 and 110-4 may be connected with one end portionof the first side member 110-1, and an opposite end portion (e.g., anend portion facing the −Y-axis direction) of each of the rear members110-3 and 110-4 may be connected with one end portion of the second sidemember 110-2.

The first side member 110-1 and the second side member 110-2 may bedisposed on the opposite end portions of each of the rear members 110-3and 110-4. As the second structure 140 and/or the display 150 slidesbetween the first side member 110-1 and the second side member 110-2,the second structure 140 and/or at least part of the display 150 may beinserted into the case 110 or may be withdrawn from the case 110. Forexample, when the electronic device 100 is changed from the first stateto the second state, the second structure 140 and at least part (e.g.,the first region 151) of the display 150 may move in the first directionD1 between the first side member 110-1 and the second side member 110-2,and another part (e.g., a third region 153) of the display 150 may movein the second direction D2. In contrast, when the electronic device 100is changed from the second state to the first state, the secondstructure 140 and the at least part (e.g., the first region 151) of thedisplay 150 may move in the second direction D2 between the first sidemember 110-1 and the second side member 110-2, and the other part (e.g.,the third region 153) of the display 150 may move in the first directionD1.

When viewed from the front surface (e.g., the surface facing the +Z-axisdirection) of the electronic device 100, the frame 110-3 may be disposedsuch that at least part of the frame 110-3 overlaps the second structure140 and/or the display 150 in the +Z/−Z-axis direction, and only anotherpart of the frame 110-3 may be exposed in a lateral direction (e.g., the+X/−X-axis direction) of the electronic device 100. Furthermore, whenviewed from the rear surface (e.g., the surface facing the −Z-axisdirection) of the electronic device 100, the frame 110-3 may overlap theback cover 104 in the +Z/−Z-axis direction and may be hidden by the backcover 110-4 so as not to be visually exposed to a user.

The back cover 110-4 may form at least part of the rear surface of theelectronic device 100. For example, the back cover 110-4 may be disposedbetween the first side member 110-1 and the second side member 110-2. Inaddition, the back cover 110-4 may be disposed to at least partiallyoverlap the frame 110-3 such that the frame 110-3 is not exposed on therear surface of the electronic device 100.

The back cover 110-4 may include a window region 112 and an opaqueregion 113. The window regions 112 may be formed of a transparent ortranslucent material. For example, the window region 112 may beimplemented with at least a partial region of the back cover 110-4 thatis formed of a transparent or translucent material. At least part (e.g.,the opaque region 113) of the back cover 110-4 may be formed of polymer,coated or colored glass, ceramic, metal (e.g., aluminum, stainless steel(STS), or magnesium), or a combination of at least two of theaforementioned materials. The entire region of the back cover 110-4 maybe formed to be opaque.

A second region 152 or the third region 153 of the display 150 may bevisually exposed on the rear surface of the electronic device 100through the window region 112. For example, in the first state of theelectronic device 100, at least part of the second region 152 may bevisually exposed in a direction toward the rear surface of theelectronic device 100 through the window region 112 of the electronicdevice 100 of FIG. 1 . In the second state of the electronic device 100,at least part of the third region 153 may be visually exposed in adirection toward the rear surface of the electronic device 100 throughthe window region 112 of the electronic device 100 of FIG. 2 .

The first side member 110-1, the second side member 110-2, and/or therear members (e.g., the frame 110-3 and the back cover 110-4) of thecase 110 may be integrally formed. Additionally or alternatively, thefirst side member 110-1, the second side member 110-2, and/or the rearmembers (e.g., the frame 110-3 and the back cover 110-4) may be formedas separate components and may be assembled or fastened with oneanother.

The second structure 140 may be configured to slide relative to the case110. For example, at least part of the second structure 140 may moverelative to the case 110 in the first direction D1 or the seconddirection D2 in a state of being substantially parallel to the case 110.

The second structure 140 may include the plurality of peripheralportions 143, 144, and/or 145 that surround at least part of theperiphery of the display 150. The plurality of peripheral portions 143,144, and/or 145 may include the first peripheral portion 143 extendingin a direction perpendicular to the sliding directions of the secondstructure 140 (e.g., the first direction D1 and the second directionD2), the second peripheral portion 144 that is connected with one endportion (e.g., an end portion facing the +Y-axis direction) of the firstperipheral portion 143 and that extends in a direction parallel to thesliding directions of the second structure 140 (e.g., the firstdirection D1 and the second direction D2), and the third peripheralportion 145 that is connected with an opposite end portion (e.g., an endportion facing the −Y-axis direction) of the first peripheral portion143 and that extends in the direction parallel to the sliding directionsof the second structure 140.

When the electronic device 100 is in the first state, the firstperipheral portion 143 may be disposed between the first side member110-1 and the second side member 110-2 and may be exposed on theexterior of the electronic device 100. At least part of the firstperipheral portion 143 may make contact with the first side member 110-1and the second side member 110-2 in the first state and, when theelectronic device 100 is changed from the first state to the secondstate, may move in the first direction D1 and may be spaced apart fromthe first side member 110-1 and the second side member 110-2.

The second peripheral portion 144 and the third peripheral portion 145may be inserted into or withdrawn from the first side member 110-1 andthe second side member 110-2, respectively. For example, when the firstperipheral portion 143 moves in the first direction D1, the secondperipheral portion 144 may be withdrawn from the first side member110-1, and the third peripheral portion 145 may be withdrawn from thesecond side member 110-2. In contrast, when the first peripheral portion143 moves in the second direction D2, at least part of the secondperipheral portion 144 may be inserted into the first side member 110-1,and at least part of the third peripheral portion 145 may be insertedinto the second side member 110-2.

The display 150 may include the first region 151, the second region 152,and the third region 153. The second region 152 may extend from thefirst region 151, and the third region 153 may extend from the secondregion 152. For example, the second region 152 may be located betweenthe first region 151 and the third region 153.

The display 150 may be disposed on the second structure 140. The display150 may be disposed on one surface of the second structure 140 such thatat least part of the periphery of the display 150 is surrounded by theplurality of peripheral portions 143, 144, and/or 145 of the secondstructure 140. For example, the display 150 may be disposed on thesecond structure 140 such that at least a partial region of the display150 faces a direction toward the front surface of the electronic device100 (e.g., the +Z-axis direction). The display 150 may be configured tomove together with the second structure 140 when the second structure140 slides. For example, the display 150 may be attached to the secondstructure 140 by an adhesive material (e.g., a double-sided tape orglue).

As the electronic device 100 is changed between the first state and thesecond state, an exposed region of the display 150 exposed in thedirection toward the front surface of the electronic device 100 may beexpanded or reduced. For example, in the first state, the first region151 may be exposed on the front surface of the electronic device 100 toform a front display region. In the second state, at least part of thesecond region 152, together with the first region 151, may be exposed onthe front surface of the electronic device 100 to form the front displayregion. The front display region may be defined as a region in which apredetermined screen is displayed on the front surface of the electronicdevice 100. A rear display region may be defined as a region in which apredetermined screen is displayed on the rear surface of the electronicdevice 100.

The display 150 may be formed of a flexible material such that,depending on operating states (e.g., the first state and the secondstate) of the electronic device 100, at least part of the display 150faces the direction toward the front surface of the electronic device100 (e.g., the +Z-axis direction) and another part of the display 150faces the direction toward the rear surface of the electronic device 100(e.g., the −Z-axis direction).

The first region 151 may be exposed on the front surface of theelectronic device 100 in the first state and the second state. Thesecond region 152 may be located inside the case 110 to face the rearmembers 110-3 and 110-4 in the first state. For example, at least partof the second regions 152 may be visually exposed through the rearsurface (e.g., the window region 112) of the electronic device 100 inthe first state. Furthermore, at least part of the second region 152,together with the first region 151, may be exposed on the front surfaceof the electronic device 100 in the second state. The third region 153may not be exposed by being hidden by the back cover 110-4 in the firststate and may be visually exposed through the rear surface (e.g., thewindow region 112) of the electronic device 100 in the second state. Inaddition, the entire back cover 110-4 may be formed to be opaque. Inthis case, the display 150 (e.g., the second region 152 or the thirdregion 153) may not be visually exposed through the rear surface of theelectronic device 100 in the first state and the second state.

The electronic device 100 may further include audio modules includingthe microphone hole 102 and the speaker hole 103. A microphone forobtaining an external sound may be disposed in the microphone hole 102.The speaker hole 103 may include an external speaker hole 103 and/or areceiver hole for a telephone call. In another embodiment, the speakerhole 103 and the microphone hole 102 may be implemented with a singlehole, or a speaker (e.g., a piezo speaker) may be included without thespeaker hole 103.

The electronic device 100 may further include a front camera module thatis exposed on the front surface of the electronic device 100 and a rearcamera module 108 that is exposed on the rear surface of the electronicdevice 100. The front camera module may be exposed through at least apartial region of the display 150. The front camera module (e.g., anunder display camera (UDC)) may be disposed under the display 150. Forexample, at least part of the front camera module may be disposed underthe display 150, and the front camera module may be configured to takean image of a subject through part of an active area of the display 150.Alternatively, the front camera module may not be visually exposed on aregion of the display 150.

The rear camera module 108 may include a plurality of camera modules(e.g., a dual camera or a triple camera). However, the rear cameramodule 108 is not necessarily limited to including the plurality ofcamera modules and may be implemented with one camera module. The frontcamera module and the rear camera module 108 may include one or morelenses, an image sensor, and/or an image signal processor. The rearcamera module 108 and a flash may be disposed on the rear surface of theelectronic device 100. The flash may include a light emitting diode or axenon lamp. Two or more lenses (e.g., a wide angle lens and/or atelephoto lens) and image sensors may be disposed on one surface of theelectronic device 100.

The electronic device 100 may further include a connector hole 106. Theconnector hole 106 may include a first connector hole in which aconnector (e.g., a universal serial bus (USB) connector) fortransmitting and receiving power and/or data with an external electronicdevice is received and/or a second connector hole (e.g., an earphonejack) in which a connector for transmitting and receiving audio signalswith an external electronic device is received.

The electronic device 100 may further include a key input device (e.g.,an input module 250 of FIG. 16 ). The key input device may be disposedon a side surface of the electronic device 100. The key input device maybe formed as a button type and may be disposed in the first side member110-1 and/or the second side member 110-2. Furthermore, the key inputdevice may be implemented as a soft key on the display 150.

The electronic device 100 may further include a sensor module 276. Thesensor module 276 may generate an electrical signal or a data value thatcorresponds to an operational state inside the electronic device 100 oran environmental state external to the electronic device 100. The sensormodule may include at least one of a proximity sensor, a heart ratemonitor (HRM) sensor, a fingerprint sensor, a time of flight (TOF)sensor, an ultrasonic sensor, a gesture sensor, a gyro sensor, anatmospheric pressure sensor, a magnetic sensor, an acceleration sensor,a grip sensor, a color sensor, an infrared (IR) sensor, a biosensor, atemperature sensor, a humidity sensor, or an illuminance sensor.

The electronic device 100 may be changed to the first state (e.g., thestate of FIG. 1 ) and the second state (e.g., the state of FIG. 2 ) asthe second structure 140 slides. For example, the first state may referto a closed state, and the second state may refer to an open state.

Referring to FIG. 1 , the first state may refer to the state in whichthe first region 151 of the display 150 is exposed on the front surfaceof the electronic device 100 and the second region 152 of the display150 is located inside the case 110 to face the rear members 110-3 and110-4. In the first state, the first region 151 may form the frontdisplay region (e.g., a region in which a screen is displayed on thefront surface of the electronic device 100). At least part of the secondregion 152 may form the rear display region (e.g., a region in which ascreen is displayed on the rear surface of the electronic device 100)and may be configured to receive a touch input from the outside throughthe window region 112 of the back cover 110-4 in the first state.

Referring to FIG. 2 , the second state may refer to the state in whichat least part of the second region 152 of the display 150, together withthe first region 151, is exposed on the front surface of the electronicdevice 100. As the second region 152, together with the first region151, forms the front display region in the second state, the frontdisplay region may be expanded, compared to that in the first state. Atleast part of the third region 153 of the display 150 may be visuallyexposed on the rear surface of the electronic device 100 through thewindow region 112. Additionally, the third region 153 may prevent partsdisposed inside the electronic device 100 from being visually exposed onthe rear surface of the electronic device 100 through the window region112. The third region 153 may be configured so as not to form the reardisplay region or receive a touch input through the window region 112 ofthe back cover 110-4. In addition, the third region 153 may beconfigured to form the rear display region or receive a touch inputthrough the window region 112 in the second state.

FIG. 3 is an exploded perspective view of the electronic device,according to an embodiment.

Referring to FIG. 3 , the electronic device 100 includes the case 110, afirst structure 120, a guide member 130, the second structure 140, thedisplay 150, and/or a circuit board member 190 (e.g., a printed circuitboard (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)).

The case 110 may include the first side member 110-1, the second sidemember 110-2, and the rear members (e.g., the frame 110-3 and the backcover 110-4). The case 110 may include the frame 110-3 disposed on anupper surface (e.g., a surface facing the +Z-axis direction) of the backcover 110-4, and the first side member 110-1 and the second side member110-2 disposed on opposite end portions of the frame 110-3 in alengthwise direction (e.g., the +Y/−Y-axis direction) to face eachother. The first side member 110-1, the second side member 110-2, theframe 110-3, and the back cover 110-4 may be combined together to form aspace in which at least a part of other components (e.g., the circuitboard member 190, the first structure 120, or the second structure 140)of the electronic device 100 is disposed.

The frame 110-3 may include an opening 111 formed through at least apartial region of the frame 110-3 in an up/down direction (e.g., the+Z/−Z-axis direction). The circuit board member 190 and the back cover110-4 may be disposed to at least partially face each other through theopening 111. The frame 110-3 may be disposed between the circuit boardmember 190 and the back cover 110-4, and a lower surface (e.g., asurface facing the −Z-axis direction) of the circuit board member 190and the upper surface (e.g., the surface facing the +Z-axis direction)of the back cover 110-4 may face each other through the opening 111.

The back cover 110-4 may be disposed under the frame 110-3 (e.g., in the−Z-axis direction). The back cover 110-4 may include the window region112 formed of a transparent or translucent material and the opaqueregion 113 surrounding the window region 112. When the rear surface ofthe electronic device 100 is viewed in the first state (e.g., the stateof FIG. 1 ), the window region 112 may allow a partial region (e.g., atleast part of the second region 152) of the display 150 to be visuallyexposed on the rear surface (or the back cover 110-4) of the electronicdevice 100.

The first side member 110-1 and the second side member 110-2 may includerecesses 114 and 115 formed in peripheral portions thereof,respectively, in a direction substantially parallel to the slidingdirection of the second structure 140 (e.g., the +X-axis direction orthe −X-axis direction). The recesses 114 and 115 may provide spaces thatat least part of the second peripheral portion 144 and at least part ofthe third peripheral portion 145 of the second structure 140 areinserted into or withdrawn from when the second structure 140 slidesrelative to the first structure 120. For example, when the electronicdevice 100 is changed to the first state (e.g., the state of FIG. 1 ) orthe second state (e.g., the state of FIG. 2 ), the second peripheralportion 144 may move through the recess 114 of the first side member110-1, and the third peripheral portion 145 may move through the recess115 of the second side member 110-2.

At least part of the first structure 120 may be disposed inside the case110. The first structure 120 may be fixed and/or coupled to the case110. The second structure 140 may slide relative to the first structure120 and the case 110. The first structure 120 and the case 110 may beformed as separate parts and may be assembled and/or coupled with eachother. Additionally or alternatively, the first structure 120 and thecase 110 may be integrally formed with each other to form one part.

The first structure 120 may include a first surface 121 (e.g., an uppersurface or a surface facing the +Z-axis direction), a second surface 122(e.g., a lower surface or a surface facing the −Z-axis direction) thatfaces away from the first surface 121, and a plurality of side surfaces123, 124, 125, and 126 surrounding a space between the first surface 121and the second surface 122. The plurality of side surfaces 123, 124,125, and 126 may include the first side surface 123 extending in adirection (e.g., the +Y/−Y-axis direction) perpendicular to the slidingdirections of the second structure 140 (e.g., the first direction D1 andthe second direction D2 of FIG. 1 ), the second side surface 124 facingthe first side surface 123, and the third side surface 125 and thefourth side surface 126 that connect the first side surface 123 and thesecond side surface 124 and face each other. The third side surface 125may face the first side member 110-1, and the fourth side surface 126may face the second side member 110-2.

The first structure 120 may be formed of a polymer resin (e.g.,polypropylene, polyethylene, polystyrene, polyethylene terephthalate,polyamide, polyester, polyvinyl chloride, polyurethane, polycarbonate,or polyvinylidene chloride) or metal.

At least part of the first structure 120 may be surrounded by the secondstructure 140. For example, the first surface 121, the second sidesurface 124, and at least part of the second surface 122 of the firststructure 120 may be covered by the second structure 140. The firststructure 120 may be connected with the second structure 140 such thatthe second structure 140 slides relative to the first structure 120.

The guide member 130 may connect and/or support the first structure 120and at least part of the second structure 140 such that the secondstructure 140 is able to slide. The guide member 130 may include a firstroller member 132, at least one second roller member 134, and at leastone belt member 136. Additionally, the second roller member 134 may beomitted. For example, the belt member 136 may extend to the firstsurface 121 of the first structure 120 while surrounding the secondroller member 134. Alternatively, one end portion of the belt member 136may be connected to a second support portion 140-2 of the secondstructure 140, and an opposite end portion of the belt member 136 may beconnected to the lower surface (e.g., the surface facing the −Z-axisdirection) of the first structure 120.

The first roller member 132 may be disposed on the second side surface124 of the first structure 120, and the second roller member 134 may bedisposed on the first side surface 123 of the first structure 120. Forexample, the first roller member 132 may be disposed to face toward thesecond side surface 124 from outside the first structure 120 and may becoupled so as to be rotatable relative to the first structure 120. Thesecond roller member 134 may be disposed to face toward the first sidesurface 123 from inside the first structure 120 and may be coupled so asto be rotatable relative to the first structure 120. The first rollermember 132 may include a plurality of rollers.

The belt member 136 may be disposed inside the first structure 120 to atleast partially surround the second roller member 134. For example, atleast part of the belt member 136 may be received in the first structure120, and another part of the belt member 136 may be exposed outside thefirst structure 120. Opposite end portions of the belt member 136 may beconnected to different portions of the second structure 140,respectively. The belt member 136 may be implemented with one strap (orband), or may be implemented in a form in which two or more straps (orbands) are fastened with each other. The belt member 136 may be formedof metal and/or a polymer resin.

The belt member 136 may be connected to a first support portion 140-1and the second support portion 140-2 and may provide tension to pull oneend of the second support portion 140-2 with respect to the firstsupport portion 140-1. The opposite end portions of the belt member 136may be moved in opposite directions by the first roller member 132 andthe second roller member 134 when the second structure 140 slides. Forexample, when the first support portion 140-1 moves in the firstdirection D1, the one end portion of the belt member 136 connected withthe first support portion 140-1 may move in the first direction D1, andthe opposite end portion of the belt member 136 connected with thesecond support portion 140-2 may move in the second direction D2. Incontrast, when the first support portion 140-1 moves in the seconddirection D2, the one end portion of the belt member 136 may move in thesecond direction D2, and the opposite end portion of the belt member 136may move in the first direction D1.

The first structure 120 may include, on the first surface 121, adepression 128 in which part of the belt member 136 exposed outside thefirst structure 120 is disposed. For example, a partial region of thefirst surface 121 of the first structure 120 may be recessed toward thesecond surface 122 to form the depression 128. At least part of the beltmember 136 may be disposed in the depression 128 and may move togetherin the depression 128 along a direction (e.g., the +X-axis direction) inwhich the second structure 140 slides. The belt member 136 may include aplurality of belts, and a plurality of depressions 128 corresponding tothe plurality of belts may be formed on the first structure 120. Thenumbers and/or positions of belt members 136 and depressions 128 may bevariously modified. Furthermore, the belt member 136 and/or thedepression 128 may have a different length depending on the position inwhich the belt member 136 is disposed.

The second structure 140 may be connected with the first structure 120so as to slide relative to the first structure 120, and the case 110 andmay move in the +X/−X-axis direction relative to the first structure 120and the case 110 that are relatively fixed.

The second structure 140 may be disposed to surround at least part ofthe first structure 120. For example, the second structure 140 maysurround the first surface 121, the second side surface 124, and atleast a partial region of the second surface 122 of the first structure120. The first surface 121 and the second side surface 124 of the firststructure 120 may be covered by the second structure 140 irrespective ofoperating states (e.g., the first state and the second state) of theelectronic device 100, and the region where the second surface 122 ofthe first structure 120 is covered by the second structure 140 may beexpanded or reduced depending on the operating states of the electronicdevice 100.

The second structure 140 may support the display 150. For example, thesecond structure 140 may be closely fixed to the display 150. At leastpart of the second structure 140 may be attached to the display 150through an adhesive member (e.g., a double-sided tape or glue) disposedbetween the display 150 and the second structure 140. The secondstructure 140, together with the display 150, may slide relative to thefirst structure 120.

The second structure 140 may include the first support portion 140-1 andthe second support portion 140-2. The second support portion 140-2 mayextend from the first support portion 140-1 and may be a bendableportion. The first support portion 140-1 may support at least part ofthe first region 151 of the display 150, and the second support portion140-2 may support another part of the first region 151, the secondregion 152, and/or the third region 153 of the display 150. The firstsupport portion 140-1 may be disposed to face part of the first region151. The second support portion 140-2 may be disposed to face anotherpart of the first region 151, the second region 152, and/or the thirdregion 153.

The first support portion 140-1 may include the first peripheral portion143, the second peripheral portion 144, and the third peripheral portion145. The first peripheral portion 143, the second peripheral portion144, and the third peripheral portion 145 may surround at least part ofthe first region 151. The first support portion 140-1 may be formed of asubstantially flat plate. For example, when the second structure 140slides, the first support portion 140-1 may not be deformed and may movein a state of being substantially parallel to the first structure 120.

The second support portion 140-2 may be formed of a bendable material soas to at least partially form a curved surface in response to sliding ofthe second structure 140. A bending portion of the second supportportion 140-2 may vary depending on operating states (e.g., the firststate and the second state) of the electronic device 100. The secondsupport portion 140-2 may support the display 150 such that the display150 slides while forming a curved surface in at least a partial regionthereof.

The second support portion 140-2 may include a multi joint structurethat may have a plurality of protrusions 147 that form the multi jointstructure. The plurality of protrusions 147 may protrude toward thefirst structure 120 in a state in which the second structure 140surrounds the first structure 120. For example, in a state in which atleast some of the protrusions 147 make contact with the first rollermember 132, the plurality of protrusions 147 may move as the secondstructure 140 slides.

The plurality of protrusions 147 may have a predetermined length in adirection (e.g., the +Y/−Y-axis direction) perpendicular to the slidingdirections of the second structure 140. The plurality of protrusions 147may be spaced apart from each other at predetermined intervals along adirection (e.g., the +X/−X-axis direction) substantially parallel to thesliding directions of the second structure 140. The second supportportion 140-2 may include a flexible film that extends from and/orconnects to one side of the first support portion 140-1, and theprotrusions 147 may be disposed on one surface of the flexible film. Thedisplay 150 may be disposed on an opposite surface of the flexible filmthat faces away from the one surface of the flexible film.

The second structure 140 may include a second opening 146 that is formedin at least a partial region of the first support portion 140-1. Thedisplay 150 may be electrically connected with a circuit board 191through the second opening 146 in a state of being disposed on thesecond structure 140. A connecting member 192 extending from the circuitboard 191 may be connected with the display 150 through the secondopening 146 and a first opening 129 that is formed in the firststructure 120.

The display 150 may be formed to be flexible so as to at least partiallyform a curved surface in response to sliding of the second structure140. The display 150 may be formed such that different regions (e.g.,the first region 151 and the second region 152) face each other as atleast a partial region is bent. The display 150 may include, forexample, a flexible display or a foldable display. The entire region ofthe display 150 may be formed of a flexible material. Alternatively, apartial region of the display 150 may be formed of a flexible material,and another partial region of the display 150 may be formed of anon-flexible material that is not bent.

The display 150 may include the first region 151, the second region 152,and the third region 153. The second region 152 may extend from thefirst region 151, and the third region 153 may extend from the secondregion 152. A display region of the display 150 in which a predeterminedscreen is displayed may be changed based on an area visually exposed onthe front surface and/or the rear surface of the electronic device 100.For example, in the first state, the first region 151 may be visuallyexposed on the front surface of the electronic device 100. In the secondstate, at least part of the second region 152, together with the firstregion 151, may be visually exposed on the front surface of theelectronic device 100.

The display 150 may be disposed on the second structure 140 and may movetogether with the second structure 140 relative to the first structure120 and the case 110. For example, the first region 151 may be fixed tothe first support portion 140-1 and the second support portion 140-2,and the second region 152 and the third region 153 may be fixed to thesecond support portion 140-2. The positions and/or deformation of theregions (e.g., the first region 151, the second region 152, and thethird region 153) of the display 150 depending on operating states(e.g., the first state and the second state) of the electronic device100 will be described below in more detail with reference to FIGS. 4Aand 4B.

At least part of the periphery of the third region 153 of the display150 or a rear surface of the third region 153 may be a portionelectrically connected to the circuit board member 190. For example, atleast part of the periphery of the third region 153 of the display 150may extend in one direction (e.g., the +X-axis direction) and may beelectrically connected to the circuit board member 190. Additionally oralternatively, the display 150 may include a connector 155 disposed onthe rear surface of the third region 153 of the display 150 and may beelectrically connected to the circuit board member 190 (e.g., thecircuit board 191) through the connecting member 192 (e.g., an FPCB)that is electrically connected to the connector 155.

A driver for driving light emitting elements (e.g., LEDs) included inthe display 150 may be disposed on the rear surface of the third region153 of the display 150 or an extension of the third region 153. Thedriver may include a drive circuit (e.g., a display driver integratedcircuit (DDIC)) and may have a chip on film (COF) structure.Furthermore, the driver may include a touch display driver integratedcircuit (TDDI) disposed in a chip on panel (COP) type. As a part isdisposed on the rear surface of the third region 153 of the display 150or the extension of the third region 153, the driver may decrease thedistance from the circuit board member 190, thereby reducing electricalnoise.

At least part of the display 150 may include a conductive member (e.g.,a metal sheet) that may be formed of a flexible material. For example,the metal sheet may provide flexural (e.g., flexible) characteristics tothe display 150. At least part of the metal sheet may include a bendableportion, and the bendable portion may include a plurality of openings(or, a plurality of slits) formed at specified intervals and/or alattice structure and may contribute to the flexural characteristics ofthe display 150. The flexural characteristics of the display 150 may bedetermined and/or changed depending on the number of openings (orslits), the arrangement density of the openings, and/or the shape of theopenings.

The conductive member (e.g., the metal sheet) may include a plurality ofrecesses formed at specified intervals, instead of the latticestructure. The plurality of recesses may form a recess pattern, and therecess pattern may contribute to the flexural characteristics of thedisplay 150. The lattice structure or the recess pattern may be expandedto at least part of the first region 151 of the display 150. Theconductive member including the lattice structure or the recess patternmay be formed of a plurality of layers.

The conductive member (e.g., the metal sheet) of the display 150 mayhelp to reinforce the electronic device 100 and may perform a functionof shielding ambient noise and distributing heat radiated from a heatgenerating part (e.g., a DDIC). Furthermore, the conductive member maybe operatively coupled with a conductive structure 160 and may stablyprovide performance for electrical noise of the electronic device 100and/or external interference. The conductive member may contain at leastone of copper (Cu), aluminum (Al), stainless steel (SUS), or a laminatedmember in which SUS and Al are alternately arranged (CLAD).

The circuit board member 190 may be disposed between the first structure120 and the back cover 110-4. An upper surface of the circuit boardmember 190 may face the second surface 122 of the first structure 120,and a lower surface of the circuit board member 190 may face the opening111 of the frame 110-3 and/or the back cover 110-4. Here, the uppersurface of the circuit board member 190 may refer to the surfacesubstantially facing the +Z-axis direction or the surface facing towardthe first structure 120, and the lower surface may refer to the surfacefacing away from the upper surface.

Various electronic parts included in the electronic device 100 may beelectrically connected to the circuit board member 190. The circuitboard member 190 may include a plate 193 and a plurality of circuitboards 191 disposed on the plate 193. At least one of the circuit boards191 may include a PCB and/or an FPCB. The circuit board 191 may beelectrically connected with the display 150 using the connector 155 ofthe display 150 through the connecting member 192 (e.g., an FPCB) thatextends from a partial region of the circuit board 191. A connectionstructure of the display 150 and the circuit board 191 through theconnecting member 192 will be described below with reference to FIGS. 12to 15B.

A processor 220, a memory 230, and/or an interface 277 may be mounted onthe circuit board member 190. The processor 220 may include a mainprocessor 221 and/or an auxiliary processor 223, and the main processor221 and/or the auxiliary processor 223 may include one or more of acentral processing unit, an application processor, a graphic processingunit, an image signal processor, a sensor hub processor, or acommunication processor. The memory may include a volatile memory or anonvolatile memory. The interface may include a high definitionmultimedia interface (HDMI), a USB interface, a secure digital (SD) cardinterface, and/or an audio interface. Furthermore, the interface mayelectrically or physically connect the electronic device 100 with anexternal electronic device and may include a USB connector, an SDcard/multimedia card (MMC) connector, or an audio connector.

A battery 289 may be a device for supplying power to at least onecomponent of the electronic device 100 and may be integrally disposedinside the electronic device 100, or may be disposed so as to bedetachable from the electronic device 100.

The electronic device 100 may include an 297 that is disposed betweenthe first structure 120 and the circuit board member 190 or between thecircuit board member 190 and the rear member (e.g., the back cover110-4). The antenna 297 may include a near field communication (NFC)antenna, a wireless charging antenna, and/or a magnetic securetransmission (MST) antenna. The antenna 297 may perform short-rangecommunication with an external device, or may wirelessly transmit andreceive electric power required for charging. The electronic device 100may be configured such that an antenna structure is formed by part ofthe first side member 110-1 and/or part of the second side member 110-2,or a combination thereof.

FIG. 4A is a sectional view of the electronic device, according to anembodiment. FIG. 4B is a sectional view of the electronic device,according to an embodiment.

FIG. 4A is a sectional view illustrating the first state of theelectronic device, and FIG. 4B is a sectional view illustrating thesecond state of the electronic device.

FIG. 4A illustrates a section of the electronic device taken along lineA-A′ of FIG. 1 , and FIG. 4B illustrates a section of the electronicdevice taken along line B-B′ of FIG. 2 . The section taken along lineA-A′ of FIG. 1 , the section taken along line B-B′ of FIG. 2 , and thesection taken along line C-C′ of FIG. 3 may be understood as sections ofsubstantially the same portion of the electronic device.

Referring to FIGS. 4A and 4B, the electronic device 100 includes thecase 110, the first structure 120, the second structure 140, and thedisplay 150. At least some of the components of the electronic device100 illustrated in FIGS. 4A and 4B are identical or similar to thecomponents of the electronic device 100 described above with referenceto FIGS. 1 to 3 . Therefore, repetitive descriptions will be omitted.

The first structure 120 may include the first roller member 132, thesecond roller member 134, and the belt member 136. The second structure140 may include the first support portion 140-1 and the second supportportion 140-2 extending from the first support portion 140-1 and may beslidably connected to the first structure 120. The display 150 mayinclude the first region 151, the second region 152 extending from thefirst region 151, and the third region 153 extending from the secondregion 152 and may be disposed on at least one surface of the secondstructure 140. The back cover 110-4 may include the window region 112and the opaque region 113 extending from the window region 112.

The second structure 140 may be disposed to surround at least part ofthe first structure 120. At least part of the second structure 140 maybe disposed over the first structure 120 (e.g., in the +Z-axisdirection), and another part of the second structure 140 may be disposedunder the first structure 120 (e.g., in the −Z-axis direction).

The first support portion 140-1 of the second structure 140 may bedisposed over the first structure 120 (e.g., in the +Z-axis direction),and at least part of the second support portion 140-2 may be disposedunder the first structure 120 (e.g., in the −Z-axis direction).

At least part of the second support portion 140-2 may be disposed in aspace between the first structure 120 and the back cover 110-4. The areaof the second support portion 140-2 disposed between the first structure120 and the back cover 110-4 may vary depending on operating states(e.g., the first state and the second state) of the electronic device100. As the second structure 140 slides, at least part of the secondsupport portion 140-2 may be inserted into or withdrawn from the spacebetween the first structure 120 and the back cover 110-4. The display150 may move together with the second structure 140. For example, as thesecond structure 140 slides, at least part of the second region 152 ofthe display 150, together with the second support portion 140-2, may bewithdrawn from or inserted into the space between the first structure120 and the back cover 110-4. When the second structure 140 slides, atleast part of the second region 152, together with the second supportportion 140-2 of the second structure 140, may move while rotating inresponse to rotation of the first roller member 132.

When at least part of the second region 152 is withdrawn from betweenthe first structure 120 and the back cover 110-4, a display regionexposed on the front surface (e.g., the surface facing the +Z-axisdirection) of the electronic device 100 may be expanded. In contrast,when the at least part of the second region 152 is inserted between thefirst structure 120 and the back cover 110-4, the display region exposedon the front surface of the electronic device 100 may be reduced.

The second structure 140 may be slidably connected to the firststructure 120 by the first roller member 132, the second roller member134, and the belt member 136.

The second support portion 140-2 may be disposed to surround at leastpart of the first roller member 132, and the belt member 136 may bedisposed to surround at least part of the second roller member 134. Thefirst roller member 132 and the second roller member 134 may be disposedso as to be rotatable relative to the first structure 120. For example,the opposite end portions of the belt member 136 may be connected to thefirst support portion 140-1 and the second support portion 140-2 of thesecond structure 140. As the second structure 140 and the belt member136 are connected with each other and the first roller member 132 andthe second roller member 134 are disposed between the second structure140 and the belt member 136, the second structure 140 and the beltmember 136 may be slid by rotation of the first roller member 132 andthe second roller member 134. Part of the belt member 136 and part ofthe second support portion 140-2 may be connected together between thefirst structure 120 and the back cover 110-4, and another component(e.g., the circuit board member 190 of FIG. 3 ) of the electronic device100 may be disposed in a space between the belt member 136 and the firststructure 120 and/or a space between the second support portion 140-2and the first structure 120.

The second support portion 140-2 of the second structure 140 may includea form (e.g., a multi joint module) in which a plurality of barsextending in a direction (e.g., the +Y/−Y-axis direction) that issubstantially the same as the direction of the axis of rotation of thefirst roller member 132 are arranged. The second support portion 140-2may be bent at portions having a relatively small thickness between theplurality of bars. In an embodiment, the second structure 140 may bereferred to by another term such as a flexible track or a hinge rail.

The electronic device 100 may be in the first state (e.g., the state ofFIG. 1 ) or the second state (e.g., the state of FIG. 2 ). Theelectronic device 100 may be changed to the first state or the secondstate as the second structure 140 and the display 150 move in the firstdirection D1 or the second direction D2 relative to the case 110, thefirst structure 120, and the back cover 110-4. The first state and thesecond state of the electronic device 100 may be determined depending onthe positions of the second structure 140 and the display 150.

When the electronic device 100 is in the first state, the electronicdevice 100 may be changed to the second state by sliding at least part(e.g., the first support portion 140-1) of the second structure 140 inthe first direction D1. In contrast, when the electronic device 100 isin the second state, the electronic device 100 may be changed to thefirst state by sliding the at least part (e.g., the first supportportion 140-1) of the second structure 140 in the second direction D2.

The first peripheral portion 143 of the second structure 140 may bebrought into contact with or spaced apart from the second side member110-2 of the case 110 as the second structure 140 slides. For example,in the first state, the first peripheral portion 143 may make contactwith the second side member 110-2 to form substantially the same plane(e.g., refer to FIG. 1 ), and in the second state, the first peripheralportion 143 may be spaced apart from the second side member 110-2 in thefirst direction D1 (e.g., refer to FIG. 2 ). The second side member110-2 may be formed to further protrude in the +Z-axis direction by aspecified height beyond a partial region of the display 150 that facestoward the front surface of the electronic device 100. In the firststate, the second side member 110-2 may be formed to be higher than partof the first region 151 in the +Z-axis direction, and in the secondstate, the second side member 110-2 may be formed to be higher than thefirst region 151 and part of the second region 152 in the +Z-axisdirection.

The relative position between the second side member 110-2 and the firstperipheral portion 143 and the height difference between the second sidemember 110-2 and the display 150 may be identically applied to the firstside member 110-1.

Referring to FIG. 4A, when the electronic device 100 is in the firststate, the first region 151 of the display 150 may form a display regionexposed on the front surface of the electronic device 100, and at leastpart of the second region 152 may be disposed between the firststructure 120 and the back cover 110-4 and may face toward the rearsurface of the electronic device 100 (e.g., the +Z-axis direction). Atleast part of the second regions 152 may be disposed to face the windowregion 112 of the back cover 110-4, and at least part of the thirdregion 153 may be disposed to face the opaque region 113 of the backcover 110-4. When the electronic device 100 is viewed from the rear, atleast part of the second region 152 may be visually exposed on the rearsurface of the electronic device 100 through the window region 112, andthe third region 153 may be hidden by the opaque region 113 and may notbe visually exposed. The window region 112 may extend in the lateraldirection (e.g., the −X-axis direction) of the electronic device 100. Inthis case, at least part of the second region 152 of the display 150 maybe visually exposed in the lateral direction of the electronic device100.

In the first state, the first region 151 of the display 150 may form adisplay region exposed on the front surface of the electronic device100, and the second region 152 may form a display region exposed on therear surface of the electronic device 100. The second region 152visually exposed on the rear surface of the electronic device 100through the window region 112 of the back cover 110-4 in the first statemay be configured to receive a touch input from the outside, or may beconfigured to display a predetermined screen.

The electronic device 100 may be configured such that whether to receivea touch input to the second region 152 and whether to display a screenon the second region 152 are determined depending on the direction thatthe rear surface of the electronic device 100 faces in the first state.When in the first state, the user views the first region 151 of thedisplay 150 from above (e.g., the +Z-axis direction) and the secondregion 152 faces downward (e.g., the −Z-axis direction), a touch inputto the second region 152 may be limited, or a screen may not bedisplayed on the second region 152. In contrast, when the user views thesecond region 152 from above and the first region 151 faces downward, atouch input to the second region 152 may be received, and a screen maybe displayed on the second region 152. Assuming that the user views theelectronic device 100 from a position spaced apart from the electronicdevice 100 in the +Z-axis direction in FIG. 4A, a touch input to thesecond region 152 and/or displaying a screen on the second region 152may be limited when the electronic device 100 is placed such that thesecond region 152 faces the −Z-axis direction as illustrated in FIG. 4A.In contrast, when the electronic device 100 is turned upside down in thestate of FIG. 4A such that the second region 152 faces the +Z-axisdirection, a touch input to the second region 152 and/or displaying ascreen on the second region 152 may be allowed.

Referring to FIG. 4B, when the electronic device 100 is in the secondstate, at least part of the second region 152 of the display 150,together with the first region 151, may form a display region exposed onthe front surface of the electronic device 100. When the electronicdevice 100 is changed from the first state to the second state, at leastpart of the second region 152 facing the back cover 110-4 may bewithdrawn from between the first structure 120 and the back cover 110-4and/or between the first roller member 132 and the back cover 110-4 andmay move to the front surface of the electronic device 100. As theelectronic device 100 is changed to the second state, part of the secondregion 152 that is located inside the case 110 of the electronic device100, and is not exposed when the electronic device 100 is in the firststate, may be exposed on the front surface of the electronic device 100,and thus the display region visually exposed on the front surface of theelectronic device 100 may be expanded. As the second region 152 moves,at least part of the third region 153 may be disposed to face the windowregion 112. The third region 153 may prevent other components (e.g., thecircuit board member 190) inside the electronic device 100 from beingvisually exposed through the window region 112 when the electronicdevice 100 is in the second state.

The third region 153 of the display 150 may be configured differentlyfrom the first region 151 and/or the second region 152. The first region151 and the second region 152 may be configured to display apredetermined screen, or receive a touch input, in the first state orthe second state. Unlike the first region 151 and/or the second region152, the third region 153 may serve to prevent the inside of theelectronic device 100 from being visually exposed through the windowregion 112. The third region 153 may not include a component (e.g., adisplay panel or an emissive layer) for displaying a screen and/or acomponent (e.g., a touch panel or a touch sensor) for a touch input. Thethird region 153 may be configured to display a screen or receive atouch input.

FIG. 5 illustrates the first structure, the second structure, andconductive structures of the electronic device, according to anembodiment.

FIG. 5 illustrates the second state of the electronic device,illustrates the first structure, and illustrates the first supportportion of the second structure. FIG. 5 may be a view in which thesecond support portion of the second structure is omitted forconvenience of description.

Referring to FIG. 5 , the electronic device 100 includes the case 110,the first structure 120, the second structure 140, and the conductivestructures 160.

The conductive structures 160 may be disposed between at least part ofthe first structure 120 and at least part (e.g., the first supportportion 140-1) of the second structure 140. The conductive structures160 may be disposed on the first structure 120 and the second structure140. The conductive structures 160 may make contact with each other inthe first state and the second state of the electronic device 100 toelectrically connect the first structure 120 and the second structure140. For example, a part of the conductive structures 160 may makeelectrical contact (or form an electrical connection) with part (e.g., aconductive region) of the first structure 120, and another part of theconductive structures 160 may make electrical contact with part (e.g., aconductive region) of the second structure 140. Accordingly, the firststructure 120 and the second structure 140 may maintain an electricalcontact state through the conductive structures 160 by at leastpartially containing a conductive material. The first structure 120 andthe first support portion 140-1 of the second structure 140 may containa metallic material.

The conductive structures 160 may include at least one of conductiverubber, a conductive sponge, conductive silicon, a conductive pad, anelastic body into which a conductive wire is inserted, or an elasticbody coated with a conductive material (e.g., a conductive sheet or aconductive fiber). The conductive structures 160 may be formed of amaterial having a predetermined level of elasticity so as to absorbshock when the conductive structures 160 make contact with each other inresponse to operating states (e.g., the first state and the secondstate) of the electronic device 100. The conductive structures 160 mayinclude a metal gasket capable of performing a noise shielding functionand/or a ground function.

The electronic device 100 may include other structures (e.g., sponges orcoil springs) capable of providing mobility to lower ends of theconductive structures 160 in the up/down direction (e.g., +Z/−Z-axisdirection). The electronic device 100 may decrease, through the otherstructures operatively coupled with the conductive structures 160,physical shift shock of the electronic device 100 when the conductivestructure (e.g., a first contact member 161) disposed on the firststructure 120 and the conductive structures (e.g., a second contactmember 162 and a third contact member 163) disposed on the secondstructure 140 make contact (or form a connection) with each other inresponse to a state change (e.g., the first state or the second state)of the electronic device 100.

The conductive structures 160 may include the first contact member 161,the second contact member 162, and the third contact member 163. Thefirst contact member 161 may be disposed on one of the first structure120 and the second structure 140 (e.g., the first support portion140-1). The second contact member 162 and the third contact member 163may be disposed on the other one of the first structure 120 and thesecond structure 140 on which the first contact member 161 is notdisposed. Hereinafter, an embodiment in which the first contact member161 is disposed on the first structure 120 and the second contact member162 and the third contact member 163 are disposed on the secondstructure 140 will be described. The positions of the conductivestructures 160 are not limited to the illustrated embodiment and may bechanged. Various embodiments according to the positions of theconductive structures 160 will be described below with reference toFIGS. 6 to 10B.

The first contact member 161 may be configured to have the samepotential as a ground (GND) potential of a main PCB (e.g., the circuitboard member 190 or the circuit board 191 of FIG. 3 ) through the firststructure 120. The first structure 120 may be electrically connectedwith a GND of the main PCB 191 through a passive element (e.g., aresistor, an inductor, or a capacitor) for prevention of electricalshock (e.g., refer to FIGS. 14, 15A, and 15B). The first contact member161 may have the same potential as the GND potential of the main PCB 191by making an electrical connection with at least part of the firststructure 120.

The second contact member 162 and the third contact member 163 may beconfigured to have the same potential as a GND potential of the display150 through the second structure 140 (or the first support portion 140-1of the second structure 140) that supports a display 150. The secondstructure 140 may be electrically connected with a GND of the display150 through a passive element (e.g., a resistor, an inductor, or acapacitor) for prevention of electrical shock (e.g., refer to FIGS. 12and 13 ). The second contact member 162 and the third contact member 163may have the same potential as a GND potential of the display PCB 154 bymaking electrical connection with at least part of the second structure140.

The first contact member 161 may be disposed on the first structure 120.For example, the first contact member 161 may be disposed on the firstsurface 121 of the first structure 120 and may protrude toward the firstsupport portion 140-1 (e.g., the +Z-axis direction). The first contactmember 161 may make contact with the second contact member 162 in thefirst state of the electronic device 100 and may make contact with thethird contact member 163 in the second state of the electronic device100.

The first contact member 161 may be located adjacent to the first sidesurface 123 of the first structure 120. The first structure 120 mayinclude the plurality of side surfaces 123, 124, 125, and 126 thatsurround the space between the first surface 121 and the second surface122. The plurality of side surfaces 123, 124, 125, and 126 may includethe first side surface 123 and the second side surface 124 that extendin a direction perpendicular to the sliding directions of the secondstructure 140 (e.g., the first direction D1 and the second direction D2)and that face each other, and the third side surface 125 and the fourthside surface 126 that extend in a direction parallel to the slidingdirections of the second structure 140 to connect the first side surface123 and the second side surface 124 and that face each other. The firstside surface 123 may be located in the first direction D1 from thesecond side surface 124. The first contact member 161 may be disposed onan edge region where the first side surface 123 and the first surface121 are connected with each other. The first contact member 161 may bedisposed between the second roller member 134 and the first side surface123 so as not to obstruct rotational motion of the second roller member134.

The second contact member 162 and the third contact member 163 may bedisposed on at least part of a structure (e.g., the second structure140) that supports the display 150. The second contact member 162 andthe third contact member 163 may be disposed on the first supportportion 140-1 of the second structure 140. The first support portion140-1 of the second structure 140 may include a first surface 141 onwhich the display 150 is disposed and a second surface 142 that faces adirection (e.g., −Z-axis direction) opposite to that of the firstsurface 141 and that faces the first surface 121 of the first structure120. The second contact member 162 and the third contact member 163 maybe disposed on the second surface 142 of the first support portion140-1. For example, the second contact member 162 and the third contactmember 163 may protrude from the second surface 142 of the first supportportion 140-1 toward the first surface 121 of the first structure 120(e.g., the −Z-axis direction) by a specified height. The second surface142 of the first support portion 140-1 may be disposed to face the firstsurface 121 of the first structure 120. The size of a region where thesecond surface 142 of the first support portion 140-1 and the firstsurface 121 of the first structure 120 face each other (e.g., the sizeof a region where the second surface 142 of the first support portion140-1 and the first surface 121 of the first structure 120 overlap eachother when the electronic device 100 is viewed in the +Z/−Z-axisdirection) may vary depending on operating states (e.g., the first stateand the second state) of the electronic device 100.

The second contact member 162 and the third contact member 163 may bespaced apart from each other by a specified interval (e.g., a firstdistance L1) in the sliding directions of the second structure 140(e.g., the first direction D1 and the second direction D2) such that thesecond contact member 162 makes contact with the first contact member161 in the first state of the electronic device 100 and the thirdcontact member 163 makes contact with the first contact member 161 inthe second state of the electronic device 100.

The second contact member 162 and the third contact member 163 may bedisposed parallel to each other in the sliding directions of the secondstructure 140 (e.g., the first direction D1 and the second directionD2). The second contact member 162 and the third contact member 163 maybe spaced apart from each other by the first distance L1. The firstdistance L1 may be substantially the same as a sliding distance (e.g., asecond distance L2) of the second structure 140 when the electronicdevice 100 is changed to the first state or the second state. The secondcontact member 162 may be located adjacent to the first peripheralportion 143 of the first support portion 140-1. The third contact member163 may be spaced apart from the second contact member 162 by the firstdistance L1 in the second direction D2.

According to the embodiment illustrated in FIG. 5 , the conductivestructures 160 extend in a direction perpendicular to the slidingdirections of the second structure 140 (e.g., the first direction D1 andthe second direction D2).

The first contact member 161 may be formed on a partial region of thefirst surface 121 of the first structure 120 so as to have a specifiedlength in a direction perpendicular to the sliding directions of thesecond structure 140 (e.g., the first direction D1 and the seconddirection D2). For example, the first contact member 161 may extend fromthe third side surface 125 to the fourth side surface 126. The firstcontact member 161 may extend from the edge at which the first surface121 and the third side surface 125 meet to the edge at which the firstsurface 121 and the fourth side surface 126 meet.

The second contact member 162 and the third contact member 163 may beformed on partial regions of one surface (e.g., the second surface 142)of the first support portion 140-1 so as to have a specified length in adirection perpendicular to the sliding directions of the secondstructure 140 (e.g., the first direction D1 and the second directionD2). For example, the second contact member 162 may extend from thesecond peripheral portion 144 to the third peripheral portion 145. Thesecond contact member 162 may extend from the edge at which the secondsurface 142 of the first support portion 140-1 and the second peripheralportion 144 meet to the edge at which the second surface 142 of thefirst support portion 140-1 and the third peripheral portion 145 meet.Furthermore, the third contact member 163 may be formed in substantiallythe same shape as the second contact member 162. For example, the thirdcontact member 163 may extend from the edge at which the second surface142 of the first support portion 140-1 and the second peripheral portion144 meet to the edge at which the second surface 142 of the firstsupport portion 140-1 and the third peripheral portion 145 meet.

The first contact member 161, the second contact member 162, and thethird contact member 163 may extend the same length. In the case wherethe first contact member 161, the second contact member 162, and thethird contact member 163 are formed to have a predetermined length, thefirst contact member 161 and the third contact member 163 may makecontact with each other in the second state of the electronic device 100to prevent infiltration of dust and/or foreign matter into a separationspace between the first structure 120 and the second structure 140.

According to the embodiment illustrated in FIG. 5 , the first contactmember 161 is disposed on the first structure 120, and the secondcontact member 162 and the third contact member 163 are disposed on thesecond structure 140. However, the first contact member 161 may bedisposed on the second structure 140, and the second contact member 162and the third contact member 163 may be disposed on the first structure120 (e.g., refer to FIGS. 8A and 8B and FIGS. 10A and 10B). For example,when the second contact member 162 and the third contact member 163 aredisposed on the first structure 120, the third contact member 163 may belocated adjacent to the first side surface 123, and the second contactmember 162 may be spaced apart from the third contact member 163 in thesecond direction D2.

FIG. 6 illustrates the first structure, the second structure, andconductive structures of the electronic device, according to anembodiment.

FIG. 6 illustrates the second state of the electronic device, the firststructure, and the first support portion of the second structure. FIG. 6is a view in which the second support portion of the second structure isomitted for convenience of description.

Referring to FIG. 6 , the electronic device 100 includes the case 110,the first structure 120, the second structure 140, and the conductivestructures 160.

FIG. 6 illustrates an embodiment in which the conductive structures 160do not extend in a direction perpendicular to the sliding directions ofthe second structure 140 (e.g., the first direction D1 and the seconddirection D2) and are formed only on partial regions of the firstsurface 121 of the first structure 120 and/or partial regions of thesecond surface 142 of the first support portion 140-1. Therefore,repetitive descriptions will be omitted.

The conductive structures 160 may include a first contact member 161disposed on the first surface 121 of the second structure 120, and asecond contact member 162 and a third contact member 163 that aredisposed on the second surface 142 of the first support portion 140-1and are spaced apart from each other in the sliding directions of thesecond structure 140.

The first contact member 161, the second contact member 162, and thethird contact member 163 may include a plurality of conductors (e.g.,first conductors 161 a, 162 a, and 163 a, second conductors 161 b, 162b, and 163 b, third conductors 161 c, 162 c, and 163 c, and/or fourthconductors 161 d, 162 d, and 163 d) that are spaced apart from eachother in a direction perpendicular to the sliding directions of thesecond structure 140.

The first contact member 161 may include the first conductor 161 aprotruding from a partial region of the first surface 121 of the firststructure 120 toward the first support portion 140-1 (e.g., the +Z-axisdirection), the second conductor 161 b spaced apart from the firstconductor 161 a, the third conductor 161 c spaced apart from the secondconductor 161 b, and the fourth conductor 161 d spaced apart from thethird conductor 161 c. The plurality of conductors 161 a, 161 b, 161 c,and/or 161 d of the first contact member 161 may be arranged in adirection perpendicular to the sliding directions of the secondstructure 140. The plurality of conductors 161 a, 161 b, 161 c, and/or161 d of the first contact member 161 may be formed in the same sizeand/or shape. However, without being limited thereto, the plurality ofconductors 161 a, 161 b, 161 c, and/or 161 d may be formed in differentsizes and/or shapes.

The second contact member 162 may include the first conductor 162 aprotruding from a partial region of the second surface 142 of the firstsupport portion 140-1 toward the first surface 121 of the firststructure 120 (e.g., the −Z-axis direction), the second conductor 162 bspaced apart from the first conductor 162 a, the third conductor 162 cspaced apart from the second conductor 162 b, and the fourth conductor162 d spaced apart from the third conductor 162 c. The plurality ofconductors 162 a, 162 b, 162 c, and/or 162 d of the second contactmember 162 may be arranged in a direction perpendicular to the slidingdirections of the second structure 140. The plurality of conductors 162a, 162 b, 162 c, and/or 162 d of the second contact member 162 may beformed in the same size and/or shape. However, without being limitedthereto, the plurality of conductors 162 a, 162 b, 162 c, and/or 162 dmay be formed in different sizes and/or shapes.

The third contact member 163 may include the first conductor 163 aprotruding from a partial region of the second surface 142 of the firstsupport portion 140-1 toward the first surface 121 of the firststructure 120 (e.g., the −Z-axis direction), the second conductor 163 bspaced apart from the first conductor 163 a, the third conductor 163 cspaced apart from the second conductor 163 b, and the fourth conductor163 d spaced apart from the third conductor 163 c. The plurality ofconductors 163 a, 163 b, 163 c, and/or 163 d of the third contact member163 may be arranged in a direction perpendicular to the slidingdirections of the second structure 140. The plurality of conductors 163a, 163 b, 163 c, and/or 163 d of the third contact member 163 may beparallel to the plurality of conductors 162 a, 162 b, 162 c, and/or 162d of the second contact member 162 and may be spaced apart from theplurality of conductors 162 a, 162 b, 162 c, and/or 162 d by the firstdistance L1 in the second direction D2. The plurality of conductors 163a, 163 b, 163 c, and/or 163 d of the third contact member 163 may beformed in the same size and/or shape. However, the plurality ofconductors 163 a, 163 b, 163 c, and/or 163 d may be formed in differentsizes and/or shapes.

When the electronic device 100 is in the first state, the firstconductor 161 a of the first contact member 161 may make contact withthe first conductor 162 a of the second contact member 162, the secondconductor 161 b of the first contact member 161 may make contact withthe second conductor 162 b of the second contact member 162, the thirdconductor 161 c of the first contact member 161 may make contact withthe third conductor 162 c of the second contact member 162, and thefourth conductor 161 d of the first contact member 161 may make contactwith the fourth conductor 162 d of the second contact member 162.

When the electronic device 100 is in the second state, the firstconductor 161 a of the first contact member 161 may make contact withthe first conductor 163 a of the third contact member 163, the secondconductor 161 b of the first contact member 161 may make contact withthe second conductor 163 b of the third contact member 163, the thirdconductor 161 c of the first contact member 161 may make contact withthe third conductor 163 c of the third contact member 163, and thefourth conductor 161 d of the first contact member 161 may make contactwith the fourth conductor 163 d of the third contact member 163.

Referring to FIG. 6 , the plurality of conductors (e.g., the firstconductors 161 a, 162 a, and 163 a, the second conductors 161 b, 162 b,and 163 b, the third conductors 161 c, 162 c, and 163 c, and/or thefourth conductors 161 d, 162 d, and 163 d) of the first contact member161, the second contact member 162, and the third contact member 163 arespaced apart from each other at the same intervals. However, theplurality of conductors may be spaced apart from each other at differentintervals. Furthermore, the number of conductors may be variouslymodified. For example, the first contact member 161, the second contactmember 162, and the third contact member 163 may omit at least one ofthe first conductors 161 a, 162 a, 163 a, the second conductors 161 b,162 b, and 163 b, the third conductors 161 c, 162 c, and 163 c, or thefourth conductors 161 d, 162 d, and 163 d, or may additionally includefifth conductors.

Extension members that fill spaces between the plurality of conductorsmay be additionally disposed between the plurality of conductors. Anextension member may be disposed between the first conductor 161 a andthe second conductor 161 b of the first conductive member 161, betweenthe second conductor 161 b and the third conductor 161 c of the firstconductive member 161, and between the third conductor 161 c and thefourth conductor 161 d of the first conductive member 161. An extensionmember may be disposed between the first conductor 162 a and the secondconductor 162 b of the second conductive member 162, between the secondconductor 162 b and the third conductor 162 c of the second conductivemember 162, and between the third conductor 162 c and the fourthconductor 162 d of the second conductive member 162. In addition, anextension member may be disposed between the first conductor 163 a andthe second conductor 163 b of the third conductive member 163, betweenthe second conductor 163 b and the third conductor 163 c of the thirdconductive member 163, and between the third conductor 163 c and thefourth conductor 163 d of the third conductive member 163. The extensionmembers may not contain a conductive material, may be integrally formedwith the plurality of conductors, and may fill the spaces between theplurality of conductors spaced apart from each other. Additionally, asshown in FIG. 5 , the extension members may prevent infiltration offoreign matter into the separation space between the first structure 120and the second structure 140 when the electronic device 100 is in thefirst state.

FIG. 7A illustrates an operation in which the conductive structures makecontact with each other in the first state of the electronic device,according to an embodiment. FIG. 7B illustrates an operation in whichthe conductive structures make contact with each other in the secondstate of the electronic device, according to an embodiment.

FIG. 7A illustrates a state in which the first contact member and thesecond contact member make contact with each other in the first state ofthe electronic device. FIG. 7B illustrates a state in which the firstcontact member and the third contact member make contact with each otherin the second state of the electronic device.

Referring to FIGS. 7A and 7B, the electronic device 100 includes thecase 110, the first structure 120, the second structure 140, the display150, and the conductive structures 160.

FIGS. 7A and 7B illustrate an embodiment in which, as in the embodimentillustrated in FIGS. 5 and 6 , the first contact member 161 is disposedon the first structure 120 and the second contact member 162 and thethird contact member 163 are disposed on the second structure 140.Therefore, repetitive descriptions will be omitted. The first contactmember 161, the second contact member 162, and the third contact member163 described with reference to FIGS. 7A and 7B may include the firstcontact member 161, the second contact member 162, and the third contactmember 163 illustrated in FIGS. 5 and 6 .

The electronic device 100 may be changed to the first state and thesecond state as the second structure 140 slides relative to the firststructure 120 in the first direction D1 and the second direction D2. Forexample, the electronic device 100 may be changed to the second state asthe second structure 140 slides in the first direction D1 by the seconddistance L2 in the first state. Furthermore, the electronic device 100may be changed to the first state as the second structure 140 slides inthe second direction D2 by the second distance L2 in the second state.

The first structure 120 may include the first surface 121 facing towardthe display 150 or the second structure 130 and the second surface 122facing away from the first surface 121 and facing the rear members 110-3and 110-4. The second structure 140 may include the first supportportion 140-1 facing the first surface 121 of the first structure 120 inthe first state of the electronic device 100. The first support portion140-1 may include the first surface 141 on which at least part of thedisplay 150 is disposed and the second surface 142 facing away from thefirst surface 141 and facing the first surface 121 of the firststructure 120.

The size of a region where the first surface 121 of the first structure120 and the second surface 142 of the first support portion 140-1 faceeach other may be smaller when the electronic device 100 is in thesecond state than when the electronic device 100 is in the first state.For example, when the electronic device 100 is viewed in the +Z-axisdirection or the −Z-axis direction, the size of a region where the firstsurface 121 of the first structure 120 and the second surface 142 of thefirst support portion 140-1 overlap each other may be smaller when theelectronic device 100 is in the second state than when the electronicdevice 100 is in the first state.

The conductive structures 160 may include the first contact member 161disposed on the first structure 120, and the second contact member 162and the third contact member 163 disposed on the first support portion140-1 of the second structure 140.

The first contact member 161 may be disposed on a partial region of thefirst surface 121 of the first structure 120 and may protrude toward thesecond surface 142 of the first support portion 140-1 (e.g., the +Z-axisdirection). The second contact member 162 and the third contact member163 may be disposed on the second surface 142 of the first supportportion 140-1 so as to face the first surface 121 of the first structure120 and may protrude toward the first surface 121 of the first structure120 (e.g., the −Z-axis direction). The third contact member 163 may bespaced apart from the second contact member 162 by the first distance L1in the second direction D2. The first distance L1 may be substantiallythe same as the second distance L2 by which the second structure 140slides relative to the first structure 120.

The first contact member 161, the second contact member 162, and thethird contact member 163 may extend in a direction (e.g., −Y/+Y-axisdirection) perpendicular to the sliding directions of the secondstructure 140 (e.g., the first direction D1 and the second direction D2)(e.g., refer to FIG. 5 ). Furthermore, the first contact member 161, thesecond contact member 162, and the third contact member 163 may includethe plurality of conductors (e.g., the first conductors 161 a, 162 a,and 163 a, the second conductors 161 b, 162 b, and 163 b, the thirdconductors 161 c, 162 c, and 163 c, and/or the fourth conductors 161 d,162 d, and 163 d) that are spaced apart from each other in a direction(e.g., −Y/+Y-axis direction) perpendicular to the sliding directions ofthe second structure 140 (e.g., the first direction D1 and the seconddirection D2).

The conductive structures 160 may be formed in a convex protrusionshape. For example, the first contact member 161 may be formed in ashape convex toward the first support portion 140-1, and the secondcontact member 162 and the third contact member 163 may be formed in ashape convex toward the first structure 120. The first contact member161, the second contact member 162, and the third contact member 163 maybe formed of an elastic material.

When the electronic device 100 is in the first state, the first contactmember 161 may make contact with the second contact member 162. When thesecond structure 140 slides in the first direction D1 in the firststate, the electronic device 100 may be changed to the second state, andthe first contact member 161 may make contact with the third contactmember 163. In the first state of the electronic device 100, the firstcontact member 161 and the second contact member 162 may be aligned witheach other in the up/down direction (e.g., −Z/+Z-axis direction), andconvex portions of the first contact member 161 and the second contactmember 162 may be brought into close contact with each other.Furthermore, in the second state of the electronic device 100, the firstcontact member 161 and the third contact member 163 may be aligned witheach other in the up/down direction (e.g., −Z/+Z-axis direction), andconvex portions of the first contact member 161 and the third contactmember 163 may be brought into close contact with each other.

In the second state of the electronic device 100, a movement of thesecond structure 140 in the up/down direction (e.g., −Z/+Z-axisdirection) may be limited by the first contact member 161 and the thirdcontact member 163. For example, when the electronic device 100 is inthe second state, the first contact member 161 and the third contactmember 163 may make contact with each other in the up/down direction(e.g., −Z/+Z-axis direction) to support each other. As the first contactmember 161 and the third contact member 163 support each other in theseparation space between the first structure 120 and the first supportportion 140-1, the first support portion 140-1 may be stably supportedon the first structure 120 without being moved in the up/down direction(e.g., −Z/+Z-axis direction) when the first support portion 140-1protrudes outside the case 110 (e.g., in the first direction D1).

The first contact member 161, the second contact member 162, and thethird contact member 163 may each include a shock-absorbing structure ina sponge or spring form that provides mobility in the up/down direction(e.g., −Z/+Z-axis direction) when the first contact member 161, thesecond contact member 162, and the third contact member 163 make contactwith each other. Accordingly, when the electronic device 100 is changedto the first state and the second state, the shock-absorbing structuresmay absorb shock generated by the contact between the first contactmember 161, the second contact member 162, and the third contact member.

The electronic device 100 may improve ground performance,electromagnetic interference (EMI), and/or electromagneticsusceptibility (EMS) by implementing a ground connection structure ofthe first structure 120 and the second structure 140 using theconductive structures 160 disposed between the first structure 120 andthe second structure 140.

The first structure 120 having a circuit board 191 disposed thereon maybe configured to have the same potential as a ground area of the circuitboard 191, and the conductive structures 160 that are disposed on thefirst structure 120 may be configured to have the same potential as thefirst structure 120. The first support portion 140-1 of the secondstructure 140 supporting the display 150 may be configured to have thesame potential as a ground area of the display 150, and the conductivestructures 160 that are disposed on the first support portion 140-1 maybe configured to have the same potential as the first support portion140-1. The conductive structure (e.g., the first contact member 161)disposed on the first structure 120 and the conductive structures (e.g.,the second contact member 162 and the third contact member 163) disposedon the first support portion 140-1 may maintain an electrical contactstate in the first state and the second state of the electronic device100. The electronic device 100 may be configured such that the firststructure 120 and the second structure 140 have the same potentialthrough the conductive structures 160, and the circuit board 191 and thedisplay 150 maintain grounds having the same potential.

As the electronic device 100 has a structural feature of being changedto the first state and the second state, a connecting member (e.g., theconnecting member 192) that electrically connects the display 150 andthe circuit board 191 may be implemented with a long FPCB to enablesliding motion of the electronic device 100 (e.g., refer to FIGS. 12 and13 ). As the connecting member 192 is formed to be long, the connectingmember 192 may fail to provide a sufficient ground capacity, and whenthe display 150 and the circuit board 191 are ground connected onlythrough the connecting member 192, the connecting member 192 may affectEMI/EMS performance and/or antenna performance.

The electronic device 100 may include the conductive structures 160 thatbring the first structure 120 into electrical contact with the secondstructure 140, in addition to the connecting member 192 directlyelectrically connecting the circuit board 191 and the display 150,thereby improving electromagnetic compatibility (EMC) performance and/orradio frequency (RF) noise performance.

FIG. 8A illustrates an operation in which the conductive structures makecontact with each other in the first state of the electronic device,according to an embodiment. FIG. 8B illustrates an operation in whichthe conductive structures make contact with each other in the secondstate of the electronic device, according to an embodiment.

FIG. 8A illustrates a state in which the first contact member and thesecond contact member make contact with each other in the first state ofthe electronic device. FIG. 8B illustrates a state in which the firstcontact member and the third contact member make contact with each otherin the second state of the electronic device.

Referring to FIGS. 8A and 8B, the electronic device 100 includes thecase 110, the first structure 120, the second structure 140, the display150, and the conductive structures 160.

FIGS. 8A and 8B illustrate an embodiment in which the positions of theconductive structures 160 are changed such that the first contact member161 is disposed on the second structure 140 and the second contactmember 162 and the third contact member 163 are disposed on the firststructure 120. Therefore, repetitive descriptions will be omitted.

The conductive structures 160 may include the first contact member 161disposed on the first support portion 140-1 of the second structure 140,and the second contact member 162 and the third contact member 163disposed on the first structure 120.

The first contact member 161 may be disposed on a partial region of thesecond surface 142 of the first support portion 140-1 and may protrudetoward the first surface 121 of the first structure 120 (e.g., the−Z-axis direction). The second contact member 162 and the third contactmember 163 may be disposed on the first surface 121 of the firststructure 120 so as to face the second surface 142 of the first supportportion 140-1 and may protrude toward the second surface 142 of thefirst support portion 140-1 (e.g., the +Z-axis direction). The thirdcontact member 163 may be spaced apart from the second contact member162 by the first distance L1 in the first direction D1. The firstdistance L1 may be substantially the same as the second distance L2 bywhich the second structure 140 slides relative to the first structure120.

When the electronic device 100 is in the first state, the first contactmember 161 may make contact with the second contact member 162. When thesecond structure 140 slides in the first direction D1 in the firststate, the electronic device 100 may be changed to the second state, andthe first contact member 161 may make contact with the third contactmember 163. In the first state of the electronic device 100, the firstcontact member 161 and the second contact member 162 may be aligned witheach other in the up/down direction (e.g., −Z/+Z-axis direction), andthe convex portions of the first contact member 161 and the secondcontact member 162 may be brought into close contact with each other.Furthermore, in the second state of the electronic device 100, the firstcontact member 161 and the third contact member 163 may be aligned witheach other in the up/down direction (e.g., −Z/+Z-axis direction), andthe convex portions of the first contact member 161 and the thirdcontact member 163 may be brought into close contact with each other.

FIG. 9A illustrates an operation in which the conductive structures makecontact with each other in the first state of the electronic device,according to an embodiment. FIG. 9B illustrates an operation in whichthe conductive structures make contact with each other in the secondstate of the electronic device, according to an embodiment.

FIG. 9A illustrates a state in which the first contact member and thesecond contact member make contact with each other in the first state ofthe electronic device. FIG. 9B illustrates a state in which the firstcontact member and the third contact member make contact with each otherin the second state of the electronic device.

Referring to FIGS. 9A and 9B, the electronic device 100 includes thecase 110, the first structure 120, the second structure 140, the display150, and the conductive structures 160.

FIGS. 9A and 9B illustrate an embodiment in which the shapes of theconductive structures 160 are modified such that the conductivestructures 160 include stopping structures. Therefore, repetitivedescriptions will be omitted.

The conductive structures 160 may include the first contact member 161disposed on the first structure 120, and the second contact member 162and the third contact member 163 disposed on the first support portion140-1 of the second structure 140. The conductive structures 160 mayinclude the stopping structures such that at least parts thereofinterlock with each other when the electronic device 100 is changed tothe first state and the second state.

The first contact member 161 may include a first central portion 167-1protruding from the first surface 121 of the first structure 120 towardthe first support portion 140-1, a first protruding portion 167-2extending from the first central portion 167-1 in the first directionD1, and a second protruding portion 167-3 extending from the firstcentral portion 167-1 in the second direction D2. The second contactmember 162 may include a second central portion 168-1 protruding fromthe second surface 142 of the first support portion 140-1 toward thefirst surface 121 of the first structure 120 and a third protrudingportion 168-2 extending from the second central portion 168-1 in thesecond direction D2. The third contact member 163 may include a thirdcentral portion 169-1 protruding from the second surface 142 of thefirst support portion 140-1 toward the first surface 121 of the firststructure 120 and a fourth protruding portion 169-2 extending from thethird central portion 169-1 in the first direction D1. The third contactmember 163 may be spaced apart from the second contact member 162 by thefirst distance L1 in the second direction D2. The first distance L1 maybe substantially the same as the second distance L2 by which the secondstructure 140 slides relative to the first structure 120.

When the electronic device 100 is in the first state, the first contactmember 161 may make contact with the second contact member 162. When thesecond structure 140 slides in the first direction D1 in the firststate, the electronic device 100 may be changed to the second state, andthe first contact member 161 may make contact with the third contactmember 163. In the first state of the electronic device 100, the firstprotruding portion 167-2 of the first contact member 161 and the thirdprotruding portion 168-2 of the second contact member 162 may be broughtinto close contact with each other while interlocking with each other inthe up/down direction (e.g., −Z/+Z-axis direction). In the second stateof the electronic device 100, the second protruding portion 167-3 of thefirst contact member 161 and the fourth protruding portion 169-2 of thethird contact member 163 may be brought into close contact with eachother while interlocking with each other in the up/down direction (e.g.,−Z/+Z-axis direction).

When changed to the first state and the second state, the electronicdevice 100, through the conductive structures 160 including the stoppingstructures, may limit a sliding range of the second structure 140 andmay alleviate shock generated in the change process. For example, whenthe electronic device 100 is changed from the first state to the secondstate, the third contact member 163 may be stopped by the first contactmember 161, and the first contact member 161 may limit an additionalmovement of the first support portion 140-1 in the first direction D1.When the electronic device 100 is changed from the second state to thefirst state, the second contact member 162 may be stopped by the firstcontact member 161, and the first contact member 161 may limit anadditional movement of the first support portion 140-1 in the seconddirection D2. Furthermore, the conductive structures 160 may contain anelastic material. Accordingly, the conductive structures 160 may absorbshock generated when the first contact member 161 makes contact with thesecond contact member 162 and the third contact member 163 in theprocess in which the electronic device 100 is changed to the first stateand the second state.

FIG. 10A illustrates an operation in which the conductive structuresmake contact with each other in the first state of the electronicdevice, according to an embodiment. FIG. 10B illustrates an operation inwhich the conductive structures make contact with each other in thesecond state of the electronic device, according to an embodiment.

FIG. 10A illustrates a state in which the first contact member and thesecond contact member make contact with each other in the first state ofthe electronic device. FIG. 10B illustrates a state in which the firstcontact member and the third contact member make contact with each otherin the second state of the electronic device.

Referring to FIGS. 10A and 10B, the electronic device 100 includes thecase 110, the first structure 120, the second structure 140, the display150, and the conductive structures 160.

FIGS. 10A and 10B illustrate an embodiment in which the positions of theconductive structures 160 are changed such that the first contact member161 is disposed on the second structure 140 and the second contactmember 162 and the third contact member 163 are disposed on the firststructure 120. Therefore, repetitive descriptions will be omitted.

The first contact member 161 may include the first central portion 167-1protruding from the second surface 142 of the first support portion140-1 toward the first surface 121 of the first structure 120, the firstprotruding portion 167-2 extending from the first central portion 167-1in the first direction D1, and the second protruding portion 167-3extending from the first central portion 167-1 in the second directionD2. The second contact member 162 may include the second central portion168-1 protruding from the first surface 121 of the first structure 120toward the second surface 142 of the first support portion 140-1 and thethird protruding portion 168-2 extending from the second central portion168-1 in the first direction D1. The third contact member 163 mayinclude the third central portion 169-1 protruding from the firstsurface 121 of the first structure 120 toward the second surface 142 ofthe first support portion 140-1 and the fourth protruding portion 169-2extending from the third central portion 169-1 in the second directionD2. The third contact member 163 may be spaced apart from the secondcontact member 162 by the first distance L1 in the first direction D1.The first distance L1 may be substantially the same as the seconddistance L2 by which the second structure 140 slides relative to thefirst structure 120.

When the electronic device 100 is in the first state, the first contactmember 161 may make contact with the second contact member 162. When thesecond structure 140 slides in the first direction D1 in the firststate, the electronic device 100 may be changed to the second state, andthe first contact member 161 may make contact with the third contactmember 163. In the first state of the electronic device 100, the secondprotruding portion 167-3 of the first contact member 161 and the thirdprotruding portion 168-2 of the second contact member 162 may be broughtinto close contact with each other while interlocking with each other inthe up/down direction (e.g., −Z/+Z-axis direction). In the second stateof the electronic device 100, the first protruding portion 167-2 of thefirst contact member 161 and the fourth protruding portion 169-2 of thethird contact member 163 may be brought into close contact with eachother while interlocking with each other in the up/down direction (e.g.,−Z/+Z-axis direction).

FIG. 11 illustrates an electrical contact structure of the display ofthe electronic device and the second support portion of the secondstructure, according to an embodiment.

Referring to FIG. 11 , the electronic device 100 includes the case 110,the first structure 120, the second structure 140, the display 150, thefirst roller member 132, the second roller member 134, and a conductivelayer 196.

At least some of the components of the electronic device 100 illustratedin FIG. 11 are identical or similar to the components illustrated inFIGS. 3, 4A, and 4B. Therefore, repetitive descriptions will be omitted.

The second structure 140 may include the first support portion 140-1 andthe second support portion 140-2 extending from the first supportportion 140-1. For example, the second support portion 140-2 may be abendable portion. The second support portion 140-2 may include the multijoint structure. The second structure 140 may support the display 150.For example, the display 150 may be disposed on the first supportportion 140-1 and the second support portion 140-2.

The conductive layer 196 may be disposed between at least part of thesecond structure 140 and the display 150, and may extend from between atleast part of the first support portion 140-1 and the display 150 tobetween the second support portion 140-2 and the display 150. However,the conductive layer 196 may also be disposed between the display 150and the second support portion 140-2. The conductive layer 196 may beattached between the display 150 and the second support portion 140-2,and may include at least one of a conductive film, a conductive sheet,or a conductive tape. However, the conductive layer 196 and the display150 may also be integrally formed with each other to form one part. Theconductive layer 196 may serve as a conductive member (e.g., a metalsheet) of the display 150. The conductive layer 196 may be formed to bebendable and may be deformed in response to a state (e.g., the firststate or the second state) change of the electronic device 100.

The conductive layer 196 may be electrically connected with the groundarea of the display 150. The second support portion 140-2 may be formedof a conductive material including metal and may be electricallyconnected with the conductive layer 196. The second support portion140-2 may be configured to have the same potential as the ground area ofthe display 150 through the conductive layer 196. The second supportportion 140-2 may be electrically connected with the first structure 120through at least one of the first roller member 132, the belt member136, or a conductive region 197.

The ground area of the display 150 and the ground area of the circuitboard 191 may be electrically connected with each other through theconductive layer 196 disposed between the display 150 and the secondsupport portion 140-2.

FIG. 12 illustrates a display of an electronic device, according to anembodiment. FIG. 13 illustrates a second structure and the display ofthe electronic device, according to an embodiment.

Referring to FIGS. 12 and 13 , the electronic device 100 includes thesecond structure 140 and the display 150. FIGS. 12 and 13 may be viewsin which for convenience of description, only a first support portion140-1, and not a second support portion, is illustrated.

The display 150 may include connector modules 154 and 155 disposed on arear surface 158 of the display 150. The connector modules 154 and 155may be electrically connected with a circuit board 191 to drive and/oroperate the display 150 and may include a drive circuit on at least partthereof. The connector modules 154 and 155 may include the display PCB154 electrically connected with at least one of a plurality of layersincluded in the display 150 and the connector 155 disposed on a partialregion of the display PCB 154. At least one electrical element may bedisposed on the display PCB 154 and may include a drive circuit to drivethe display 150. A connecting member 192 for electrical connection ofthe display 150 and the circuit board 191 may be connected to theconnector 155.

The second structure 140 may be disposed on the rear surface 159 of thedisplay 150. The first support portion 140-1 of the second structure 140may be disposed to at least partially overlap the connector modules 154and 155 when the rear surface 158 of the display 150 is viewed fromabove. When the second structure 140 and the display 150 are assembled,the second structure 140 may make electrical contact with the connectormodules 154 and 155 of the display 150. For example, a contact region156 may be formed on at least a partial region of the display PCB 154,and when the first support portion 140-1 is disposed on the rear surface158 of the display 150, the contact region 156 may make contact with thefirst support portion 140-1. Accordingly, the second structure 140 orthe first support portion 140-1, which is formed of a conductivematerial, and the display 150 or the display PCB 154 may be electricallyconnected (e.g., GND connected) with each other.

The connecting member 192 may electrically connect the display 150 andthe circuit board 191. For example, one end of the connecting member 192may be connected to the connector 155, and an opposite end of theconnecting member 192 may be connected to the circuit board 191. Thefirst support portion 140-1 may have a second opening 146 formed thereinsuch that the connecting member 192 extends from the connector 155 tothe circuit board 191 through the second opening 146. At least part ofthe connecting member 192 may pass through the second opening 146, andthe opposite end portions of the connecting member 192 may be connectedto the connector 155 and the circuit board 191, respectively (e.g.,refer to FIGS. 15A and 15B).

A series capacitor or a switching element may be provided between theconnecting member 192 and the display 150 or the display PCB 154. Theprocessor 220 of the electronic device may control the switching elementin response to a state change (e.g., the first state or the secondstate) of the display 150 and may electrically connect the display 150and the circuit board 191 based on the control of the switching element.

FIG. 14 illustrates an electrical connection structure of a display anda circuit board of an electronic device, according to an embodiment.FIG. 15A illustrates the electrical connection structure of the displayand the circuit board of the electronic device, according to anembodiment. FIG. 15B illustrates the electrical connection structure ofthe display and the circuit board of the electronic device, according toan embodiment.

FIGS. 15A and 15B illustrate a section taken along line D-D′ of FIG. 14.

Referring to FIGS. 14, 15A, and 15B, the electronic device 100 includesa first structure 120, a second structure 140, the display 150, thecircuit board 191, and a connecting member 192. FIGS. 14, 15A, and 15Bmay be views in which for convenience of description, only a firstsupport portion 140-1, and not a second support portion, is illustrated.

The electronic device 100 may be configured such that the display 150and the circuit board 191 are electrically connected through theconnecting member 192.

The circuit board 191 may be disposed on one surface (e.g., a surfacefacing the −Z-axis direction) of the first structure 120. The secondstructure 140 and at least part of the display 150 may be disposed on anopposite surface (e.g., a surface facing the +Z-axis direction) of thefirst structure 120 that faces away from the one surface of the firststructure 120.

The first structure 120 and the circuit board 191 may be electricallyconnected (e.g., GND connected) with each other. A contact portion 195making contact with the first structure 120 may be formed on at leastpart of the circuit board 191. The contact portion 195 may be formed onone surface (e.g., a surface facing the +Z-axis direction) of thecircuit board 191 that faces the first structure 120. The contactportion 195 may make contact with the first structure 120, which isformed of a conductive material (e.g., metal), to electrically connectthe first structure 120 and the circuit board 191. The contact portion195 may be formed of a material having electrical conductivity and mayinclude, for example, a C-clip, a conductive tape, or a conductivesponge. Furthermore, a series capacitor or a switching element may beprovided between the first structure 120 and the circuit board 191. Theprocessor 220 of the electronic device may control the switching elementin response to a state (e.g., the first state or the second state)change of the display 150 and may electrically connect the firststructure 120 and the circuit board 191 based on the control of theswitching element.

To electrically connect the circuit board 191 and the display 150, oneend portion of the connecting member 192 may be connected to a connector155 of the display 150, and an opposite end portion of the connectingmember 192 may be connected to the circuit board 191. For example, theconnecting member 192 may electrically connect a ground area of thecircuit board 191 and a ground area of the display 150. The connectingmember 192 may extend from the one end portion to the opposite endportion thereof by a predetermined length. The connecting member 192 mayinclude an FPCB or a cable.

The connecting member 192 may pass through at least part of the firststructure 120 in the up/down direction (e.g., the −Z/+Z-axis direction)to connect the display 150 and the circuit board 191 that face eachother with the first structure 120 therebetween. The first structure 120may include a first opening 129 formed through at least a partial regionof the first structure 120 in the up/down direction (e.g., the−Z/+Z-axis direction). The second structure 140 may be aligned with thefirst structure 120 and may include a second opening 146 formed throughat least a partial region of the second structure 140 in the up/downdirection (e.g., the −Z/+Z-axis direction). Between the display 150 andthe second structure 140, the one end portion of the connecting member192 may be connected to the connector 155 of the display 150. Theconnecting member 192 may extend from the one end portion thereof topass through the second opening 146 and the first opening 129, and theopposite end portion of the connecting member 192 may be connected tothe circuit board 191.

The display 150, together with the second structure 140, may be moved bya predetermined distance as the second structure 140 slides relative tothe first structure 120 in both directions (e.g., the first direction D1and the second direction D2). The connecting member 192 may beconfigured such that at least part thereof moves and/or deforms in adirection parallel to the sliding directions in response to the slidingof the second structure 140 and the display 150 relative to the firststructure 120.

The connecting member 192 may include a bending portion 192 a such thatat least part of the connecting member 192 moves in a direction parallelto the sliding directions (e.g., the first direction D1 and the seconddirection D2). The bending portion 192 a may be formed by bending atleast part of the connecting member 192 in the sliding directions (e.g.,the first direction D1 and the second direction D2). A partial region ofthe connecting member 192 and another partial region of the connectingmember 192 that extend with the bending portion 192 a therebetween maymove in opposite directions when the second structure 140 and thedisplay 150 slide. The bending portion 192 a may have the shape of “U”or “S”.

FIG. 16 is a block diagram of an electronic device in a networkenvironment according to an embodiment.

Referring to FIG. 16 , the electronic device 201 (e.g., the electronicdevice 100 of FIGS. 1 to 15 ) in the network environment 200 maycommunicate with an electronic device 202 via a first network 298 (e.g.,a short-range wireless communication network), or at least one of anelectronic device 204 or a server 208 via a second network 299 (e.g., along-range wireless communication network). According to an embodiment,the electronic device 201 may communicate with the electronic device 204via the server 208. According to an embodiment, the electronic device201 may include a processor 220, memory 230, an input module 250, asound output module 255, a display module 260, an audio module 270, asensor module 276, an interface 277, a connecting terminal 278, a hapticmodule 279, a camera module 280, a power management module 288, abattery 289, a communication module 290, a subscriber identificationmodule (SIM) 296, or an antenna module 297. In some embodiments, atleast one of the components (e.g., the connecting terminal 278) may beomitted from the electronic device 201, or one or more other componentsmay be added in the electronic device 201. In some embodiments, some ofthe components (e.g., the sensor module 276, the camera module 280, orthe antenna module 297) may be implemented as a single component (e.g.,the display module 260).

The processor 220 may execute, for example, software (e.g., a program240) to control at least one other component (e.g., a hardware orsoftware component) of the electronic device 201 coupled with theprocessor 220, and may perform various data processing or computation.According to one embodiment, as at least part of the data processing orcomputation, the processor 220 may store a command or data received fromanother component (e.g., the sensor module 276 or the communicationmodule 290) in volatile memory 232, process the command or the datastored in the volatile memory 232, and store resulting data innon-volatile memory 234. According to an embodiment, the processor 220may include a main processor 221 (e.g., a central processing unit (CPU)or an application processor (AP)), or an auxiliary processor 223 (e.g.,a graphics processing unit (GPU), a neural processing unit (NPU), animage signal processor (ISP), a sensor hub processor, or a communicationprocessor (CP)) that is operable independently from, or in conjunctionwith, the main processor 221. For example, when the electronic device201 includes the main processor 221 and the auxiliary processor 223, theauxiliary processor 223 may be adapted to consume less power than themain processor 221, or to be specific to a specified function. Theauxiliary processor 223 may be implemented as separate from, or as partof the main processor 221.

The auxiliary processor 223 may control at least some of functions orstates related to at least one component (e.g., the display module 260,the sensor module 276, or the communication module 290) among thecomponents of the electronic device 201, instead of the main processor221 while the main processor 221 is in an inactive (e.g., sleep) state,or together with the main processor 221 while the main processor 221 isin an active state (e.g., executing an application). According to anembodiment, the auxiliary processor 223 (e.g., an image signal processoror a communication processor) may be implemented as part of anothercomponent (e.g., the camera module 280 or the communication module 290)functionally related to the auxiliary processor 223. According to anembodiment, the auxiliary processor 223 (e.g., the neural processingunit) may include a hardware structure specified for artificialintelligence model processing. An artificial intelligence model may begenerated by machine learning. Such learning may be performed, e.g., bythe electronic device 201 where the artificial intelligence is performedor via a separate server (e.g., the server 208). Learning algorithms mayinclude, but are not limited to, e.g., supervised learning, unsupervisedlearning, semi-supervised learning, or reinforcement learning. Theartificial intelligence model may include a plurality of artificialneural network layers. The artificial neural network may be a deepneural network (DNN), a convolutional neural network (CNN), a recurrentneural network (RNN), a restricted Boltzmann machine (RBM), a deepbelief network (DBN), a bidirectional recurrent deep neural network(BRDNN), deep Q-network or a combination of two or more thereof but isnot limited thereto. The artificial intelligence model may, additionallyor alternatively, include a software structure other than the hardwarestructure.

The memory 230 may store various data used by at least one component(e.g., the processor 220 or the sensor module 276) of the electronicdevice 201. The various data may include, for example, software (e.g.,the program 240) and input data or output data for a command relatedthereto. The memory 230 may include the volatile memory 232 or thenon-volatile memory 234.

The program 240 may be stored in the memory 230 as software, and mayinclude, for example, an operating system (OS) 242, middleware 244, oran application 246.

The input module 250 may receive a command or data to be used by anothercomponent (e.g., the processor 220) of the electronic device 201, fromthe outside (e.g., a user) of the electronic device 201. The inputmodule 250 may include, for example, a microphone, a mouse, a keyboard,a key (e.g., a button), or a digital pen (e.g., a stylus pen).

The sound output module 255 may output sound signals to the outside ofthe electronic device 201. The sound output module 255 may include, forexample, a speaker or a receiver. The speaker may be used for generalpurposes, such as playing multimedia or playing record. The receiver maybe used for receiving incoming calls. According to an embodiment, thereceiver may be implemented as separate from, or as part of the speaker.

The display module 260 may visually provide information to the outside(e.g., a user) of the electronic device 201. The display module 260 mayinclude, for example, a display, a hologram device, or a projector andcontrol circuitry to control a corresponding one of the display,hologram device, and projector. According to an embodiment, the displaymodule 260 may include a touch sensor adapted to detect a touch, or apressure sensor adapted to measure the intensity of force incurred bythe touch.

The audio module 270 may convert a sound into an electrical signal andvice versa. According to an embodiment, the audio module 270 may obtainthe sound via the input module 250, or output the sound via the soundoutput module 255 or a headphone of an external electronic device (e.g.,an electronic device 202) directly (e.g., wiredly) or wirelessly coupledwith the electronic device 201.

The sensor module 276 may detect an operational state (e.g., power ortemperature) of the electronic device 201 or an environmental state(e.g., a state of a user) external to the electronic device 201, andthen generate an electrical signal or data value corresponding to thedetected state. According to an embodiment, the sensor module 276 mayinclude, for example, a gesture sensor, a gyro sensor, an atmosphericpressure sensor, a magnetic sensor, an acceleration sensor, a gripsensor, a proximity sensor, a color sensor, an infrared (IR) sensor, abiometric sensor, a temperature sensor, a humidity sensor, or anilluminance sensor.

The interface 277 may support one or more specified protocols to be usedfor the electronic device 201 to be coupled with the external electronicdevice (e.g., the electronic device 202) directly (e.g., wiredly) orwirelessly. According to an embodiment, the interface 277 may include,for example, a high definition multimedia interface (HDMI), a USBinterface, an SD card interface, or an audio interface.

A connecting terminal 278 may include a connector via which theelectronic device 201 may be physically connected with the externalelectronic device (e.g., the electronic device 202). According to anembodiment, the connecting terminal 278 may include, for example, a HDMIconnector, a USB connector, a SD card connector, or an audio connector(e.g., a headphone connector).

The haptic module 279 may convert an electrical signal into a mechanicalstimulus (e.g., a vibration or a movement) or electrical stimulus whichmay be recognized by a user via his tactile sensation or kinestheticsensation. According to an embodiment, the haptic module 279 mayinclude, for example, a motor, a piezoelectric element, or an electricstimulator.

The camera module 280 may capture a still image or moving images.According to an embodiment, the camera module 280 may include one ormore lenses, image sensors, image signal processors, or flashes.

The power management module 288 may manage power supplied to theelectronic device 201. According to one embodiment, the power managementmodule 288 may be implemented as at least part of, for example, a powermanagement integrated circuit (PMIC).

The battery 289 may supply power to at least one component of theelectronic device 201. According to an embodiment, the battery 289 mayinclude, for example, a primary cell which is not rechargeable, asecondary cell which is rechargeable, or a fuel cell.

The communication module 290 may support establishing a direct (e.g.,wired) communication channel or a wireless communication channel betweenthe electronic device 201 and the external electronic device (e.g., theelectronic device 202, the electronic device 204, or the server 208) andperforming communication via the established communication channel. Thecommunication module 290 may include one or more communicationprocessors that are operable independently from the processor 220 (e.g.,the AP) and supports a direct (e.g., wired) communication or a wirelesscommunication. According to an embodiment, the communication module 290may include a wireless communication module 292 (e.g., a cellularcommunication module, a short-range wireless communication module, or aglobal navigation satellite system (GNSS) communication module) or awired communication module 294 (e.g., a local area network (LAN)communication module or a power line communication (PLC) module). Acorresponding one of these communication modules may communicate withthe external electronic device via the first network 298 (e.g., ashort-range communication network, such as Bluetooth™, wireless-fidelity(Wi-Fi) direct, or infrared data association (IrDA)) or the secondnetwork 299 (e.g., a long-range communication network, such as a legacycellular network, a 5G network, a next-generation communication network,the Internet, or a computer network (e.g., LAN or wide area network(WAN)). These various types of communication modules may be implementedas a single component (e.g., a single chip), or may be implemented asmulti components (e.g., multi chips) separate from each other. Thewireless communication module 292 may identify and authenticate theelectronic device 201 in a communication network, such as the firstnetwork 298 or the second network 299, using subscriber information(e.g., international mobile subscriber identity (IMSI)) stored in thesubscriber identification module 296.

The wireless communication module 292 may support a 5G network, after a4G network, and next-generation communication technology, e.g., newradio (NR) access technology. The NR access technology may supportenhanced mobile broadband (eMBB), massive machine type communications(mMTC), or ultra-reliable and low-latency communications (URLLC). Thewireless communication module 292 may support a high-frequency band(e.g., the mmWave band) to achieve, e.g., a high data transmission rate.The wireless communication module 292 may support various technologiesfor securing performance on a high-frequency band, such as, e.g.,beamforming, massive multiple-input and multiple-output (massive MIMO),full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, orlarge scale antenna. The wireless communication module 292 may supportvarious requirements specified in the electronic device 201, an externalelectronic device (e.g., the electronic device 204), or a network system(e.g., the second network 299). According to an embodiment, the wirelesscommunication module 292 may support a peak data rate (e.g., 20 Gbps ormore) for implementing eMBB, loss coverage (e.g., 164 dB or less) forimplementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each ofdownlink (DL) and uplink (UL), or a round trip of 1 ms or less) forimplementing URLLC.

The antenna module 297 may transmit or receive a signal or power to orfrom the outside (e.g., the external electronic device) of theelectronic device 201. According to an embodiment, the antenna module297 may include an antenna including a radiating element composed of aconductive material or a conductive pattern formed in or on a substrate(e.g., a PCB). According to an embodiment, the antenna module 297 mayinclude a plurality of antennas (e.g., array antennas). In such a case,at least one antenna appropriate for a communication scheme used in thecommunication network, such as the first network 298 or the secondnetwork 299, may be selected, for example, by the communication module290 (e.g., the wireless communication module 292) from the plurality ofantennas. The signal or the power may then be transmitted or receivedbetween the communication module 290 and the external electronic devicevia the selected at least one antenna. According to an embodiment,another component (e.g., a radio frequency integrated circuit (RFIC))other than the radiating element may be additionally formed as part ofthe antenna module 297.

According to various embodiments, the antenna module 297 may form ammWave antenna module. According to an embodiment, the mmWave antennamodule may include a printed circuit board, a RFIC disposed on a firstsurface (e.g., the bottom surface) of the printed circuit board, oradjacent to the first surface and capable of supporting a designatedhigh-frequency band (e.g., the mmWave band), and a plurality of antennas(e.g., array antennas) disposed on a second surface (e.g., the top or aside surface) of the printed circuit board, or adjacent to the secondsurface and capable of transmitting or receiving signals of thedesignated high-frequency band.

At least some of the above-described components may be coupled mutuallyand communicate signals (e.g., commands or data) therebetween via aninter-peripheral communication scheme (e.g., a bus, general purposeinput and output (GPIO), serial peripheral interface (SPI), or mobileindustry processor interface (MIPI)).

According to an embodiment, commands or data may be transmitted orreceived between the electronic device 201 and the external electronicdevice 204 via the server 208 coupled with the second network 299. Eachof the electronic devices 202 or 204 may be a device of a same type as,or a different type, from the electronic device 201. According to anembodiment, all or some of operations to be executed at the electronicdevice 201 may be executed at one or more of the external electronicdevices 202, 204, or 208. For example, if the electronic device 201should perform a function or a service automatically, or in response toa request from a user or another device, the electronic device 201,instead of, or in addition to, executing the function or the service,may request the one or more external electronic devices to perform atleast part of the function or the service. The one or more externalelectronic devices receiving the request may perform the at least partof the function or the service requested, or an additional function oran additional service related to the request, and transfer an outcome ofthe performing to the electronic device 201. The electronic device 201may provide the outcome, with or without further processing of theoutcome, as at least part of a reply to the request. To that end, acloud computing, distributed computing, mobile edge computing (MEC), orclient-server computing technology may be used, for example. Theelectronic device 201 may provide ultra low-latency services using,e.g., distributed computing or mobile edge computing. In anotherembodiment, the external electronic device 204 may include aninternet-of-things (IoT) device. The server 208 may be an intelligentserver using machine learning and/or a neural network. According to anembodiment, the external electronic device 204 or the server 208 may beincluded in the second network 299. The electronic device 201 may beapplied to intelligent services (e.g., smart home, smart city, smartcar, or healthcare) based on 5G communication technology or IoT-relatedtechnology.

An electronic device according to an embodiment of the disclosure mayinclude a case including a rear member and side members disposed atopposite ends of the rear members, a first structure, at least part ofwhich is disposed inside the case, a second structure connected with thefirst structure so as to slide relative to the first structure, adisplay that is disposed on the second structure and that moves togetherwith the second structure relative to the first structure, the displayincluding a first region and a second region extending from the firstregion, and a conductive structure that is disposed between at leastpart of the first structure and at least part of the second structureand that electrically connects the first structure and the secondstructure. The electronic device may include a first state in which thefirst region is exposed on a front surface of the electronic device andthe second region is located inside the case to face the rear membersand a second state in which at least part of the second region, togetherwith the first region, is exposed on the front surface of the electronicdevice as at least part of the second structure slides in a firstdirection in the first state. The conductive structure may include afirst contact member disposed on one of the first structure and thesecond structure, and a second contact member and a third contact memberdisposed on the other one of the first structure and the secondstructure. The second contact member and the third contact member may bespaced apart from each other by a first distance in a sliding directionof the second structure. The first contact member may make contact withthe second contact member in the first state to electrically connect thefirst structure and the second structure and may make contact with thethird contact member in the second state to electrically connect thefirst structure and the second structure. The second structure may sliderelative to the first structure by the first distance when theelectronic device is changed from the first state to the second state orfrom the second state to the first state.

The first structure may include a first surface that faces toward thefirst region of the display and a second surface that faces away fromthe first surface. The second structure may include a first supportportion and a second support portion extending from the first supportportion, the second support portion being a bendable portion. The firstsupport portion may be disposed to face the first surface of the firststructure and may be configured such that a size of a region where thefirst support portion and the first surface of the first structure faceeach other varies depending on the first state and the second state.

The first contact member may be disposed on the first surface of thefirst structure and may protrude toward the first support portion, andthe second contact member and the third contact member may be disposedon one surface of the first support portion to face the first surface ofthe first structure and may protrude toward the first surface of thefirst structure.

The third contact member may be spaced apart from the second contactmember by the first distance in a second direction opposite to the firstdirection.

The first contact member may be disposed on one surface of the firstsupport portion and may protrude toward the first surface of the firststructure, and the second contact member and the third contact membermay be disposed on the first surface of the first structure to face theone surface of the first support portion and may protrude toward thefirst support portion.

The third contact member may be spaced apart from the second contactmember by the first distance in the first direction.

The first structure may further include a plurality of side surfacesthat surround a space between the first surface of the first structureand the second surface of the first structure. The plurality of sidesurfaces may include a first side surface extending in a directionperpendicular to the first direction, a second side surface that facesthe first side surface, and a third side surface and a fourth sidesurface that connect the first side surface and the second side surfaceand face each other. The first side surface may be located in the firstdirection from the second side surface.

When the first contact member is disposed on the first structure, thefirst contact member may be located on the first surface of the firststructure so as to be adjacent to the first side surface, and when thesecond contact member and the third contact member are disposed on thefirst structure, the third contact member may be located on the firstsurface of the first structure so as to be adjacent to the first sidesurface, and the second contact member may be located to be spaced apartfrom the third contact member by the first distance in a directiontoward the second side surface.

The first contact member, the second contact member, and the thirdcontact member may extend in a direction perpendicular to the firstdirection by a predetermined length.

Each of the first contact member, the second contact member, and thethird contact member may include a first conductor and a secondconductor spaced apart from the first conductor in a directionperpendicular to the first direction.

The first structure and the second structure may at least partiallycontain a conductive material.

The second structure 140 may slide relative to the first structure by asecond distance in the first direction or a second direction opposite tothe first direction, and the second distance may be equal to the firstdistance.

The conductive structure may include at least one of conductive rubber,a conductive sponge, conductive silicon, an elastic body into which aconductive wire is inserted, or an elastic body coated with a conductivematerial.

The first contact member may include a first central portion, a firstprotruding portion extending from the first central portion in the firstdirection, and a second protruding portion extending from the firstcentral portion in a second direction opposite to the first direction.The second contact member may include a second central portion and athird protruding portion extending from the second central portion inone of the first direction and the second direction. The third contactmember may include a third central portion and a fourth protrudingportion extending from the third central portion in a direction oppositeto the direction in which the third protruding portion extends.

The third protruding portion may be configured to interlock with one ofthe first protruding portion and the second protruding portion in thefirst state, and the fourth protruding portion may be configured tointerlock with the other one of the first protruding portion and thesecond protruding portion in the second state.

The electronic device may further include a circuit board that isdisposed on at least part of the first structure and to which thedisplay is electrically connected. The first structure may have a firstpotential equal to a ground potential of the circuit board, and thesecond structure may have a second potential equal to a ground potentialof the display. The conductive structure may allow the first potentialand the second potential to form the same potential.

The first structure may include a first roller member disposed on oneside of the first structure so as to be rotatable, a second rollermember disposed on an opposite side of the first structure so as to berotatable, and a belt member that is disposed to at least partiallysurround the second roller member and that has opposite end portionsconnected to the second structure. The first roller member may beconfigured to rotate about a first axis of rotation perpendicular to thesliding direction of the second structure in a state of making contactwith the second support portion, and the second roller member may beconfigured to rotate about a second axis of rotation parallel to thefirst axis of rotation in a state of making contact with the beltmember.

The second support portion may include a first edge connected with thefirst support portion and a second edge that forms an end portion of thesecond support portion, and the first edge and the second edge may beconfigured to move in opposite directions, respectively, when the secondstructure 140 slides relative to the first structure.

An electronic device 100 according to an embodiment may include a case,a first structure, at least part of which is disposed inside the case,display structures that are disposed to slide relative to the firststructure and that includes a second structure slidably connected to thefirst structure and having at least a portion formed in a multi jointstructure and a flexible display disposed on the second structure, afirst roller member that is disposed between one side of the firststructure and the second structure so as to be rotatable and thatrotates in a state of making contact with the multi joint structure ofthe second structure when the second structure slides, and a conductivestructure that electrically connects the first structure and the secondstructure and that includes a first contact member disposed on one ofthe first structure and the second structure, and a second contactmember and a third contact member disposed on the other one of the firststructure and the second structure and spaced apart from each other by afirst distance in a sliding direction of the second structure Theelectronic device may include a first state in which a first region ofthe flexible display forms a front surface of the electronic device anda second region extending from the first region is located inside thecase and a second state in which at least part of the second region,together with the first region, forms the front surface of theelectronic device as at least part of the second structure slides in afirst direction by a second distance in the first state. The firstdistance may be equal to the second distance, and the first contactmember may make contact with the second contact member in the firststate and may make contact with the third contact member in the secondstate.

The first structure and the second structure may at least partiallycontain a metallic material, and the conductive structure may include atleast one of conductive rubber, a conductive sponge, or conductivesilicon.

The electronic device may implement a ground contact structure of thefirst structure and the second structure through the conductivestructures disposed between the first structure and the secondstructure.

Furthermore, the first structure having the circuit board disposedthereon and the second structure having the display disposed thereon maymake electrical contact with each other through the conductivestructures. Accordingly, the electronic device may improve groundperformance and may stably maintain performance for electrical noise andexternal interference.

Moreover, the conductive structures may make contact with each otherdepending on operating states of the electronic device. Accordingly, theelectronic device may prevent a movement of the electronic device andinfiltration of foreign matter into the electronic device.

In addition, the conductive structures may make a connection (e.g.,contact) with each other depending on operating states (e.g., the firststate and the second state) of the electronic device. Accordingly, theelectronic device may support the support part (e.g., the secondstructure) of the display such that a movement (e.g., in the up/downdirection) of the support part (e.g., the second structure) does notoccur and may provide a stable movement (e.g., sliding) of the display.

In addition, the disclosure may provide various effects that aredirectly or indirectly recognized.

The electronic device according to various embodiments may be one ofvarious types of electronic devices. The electronic devices may include,for example, a portable communication device (e.g., a smartphone), acomputer device, a portable multimedia device, a portable medicaldevice, a camera, a wearable device, or a home appliance. According toan embodiment of the disclosure, the electronic devices are not limitedto those described above.

It should be appreciated that various embodiments of the disclosure andthe terms used therein are not intended to limit the technologicalfeatures set forth herein to particular embodiments and include variouschanges, equivalents, or replacements for a corresponding embodiment.With regard to the description of the drawings, similar referencenumerals may be used to refer to similar or related elements. It is tobe understood that a singular form of a noun corresponding to an itemmay include one or more of the things, unless the relevant contextclearly indicates otherwise. As used herein, each of such phrases as “Aor B,” “at least one of A and B,” “at least one of A or B,” “A, B, orC,” “at least one of A, B, and C,” and “at least one of A, B, or C,” mayinclude any one of, or all possible combinations of the items enumeratedtogether in a corresponding one of the phrases. As used herein, suchterms as “1st” and “2nd,” or “first” and “second” may be used to simplydistinguish a corresponding component from another, and does not limitthe components in other aspect (e.g., importance or order). It is to beunderstood that if an element (e.g., a first element) is referred to,with or without the term “operatively” or “communicatively”, as “coupledwith,” “coupled to,” “connected with,” or “connected to” another element(e.g., a second element), it means that the element may be coupled withthe other element directly (e.g., wiredly), wirelessly, or via a thirdelement.

As used in connection with various embodiments of the disclosure, theterm “module” may include a unit implemented in hardware, software, orfirmware, and may interchangeably be used with other terms, for example,“logic,” “logic block,” “part,” or “circuitry”. A module may be a singleintegral component, or a minimum unit or part thereof, adapted toperform one or more functions. For example, according to an embodiment,the module may be implemented in a form of an application-specificintegrated circuit (ASIC).

Various embodiments as set forth herein may be implemented as software(e.g., the program 240) including one or more instructions that arestored in a storage medium (e.g., internal memory 236 or external memory238) that is readable by a machine (e.g., the electronic device 201).For example, a processor (e.g., the processor 220) of the machine (e.g.,the electronic device 201) may invoke at least one of the one or moreinstructions stored in the storage medium, and execute it, with orwithout using one or more other components under the control of theprocessor. This allows the machine to be operated to perform at leastone function according to the at least one instruction invoked. The oneor more instructions may include a code generated by a complier or acode executable by an interpreter. The machine-readable storage mediummay be provided in the form of a non-transitory storage medium. Wherein,the term “non-transitory” simply means that the storage medium is atangible device, and does not include a signal (e.g., an electromagneticwave), but this term does not differentiate between where data issemi-permanently stored in the storage medium and where the data istemporarily stored in the storage medium.

A method according to various embodiments of the disclosure may beincluded and provided in a computer program product. The computerprogram product may be traded as a product between a seller and a buyer.The computer program product may be distributed in the form of amachine-readable storage medium (e.g., compact disc read only memory(CD-ROM)), or be distributed (e.g., downloaded or uploaded) online viaan application store (e.g., PlayStore™), or between two user devices(e.g., smart phones) directly. If distributed online, at least part ofthe computer program product may be temporarily generated or at leasttemporarily stored in the machine-readable storage medium, such asmemory of the manufacturer's server, a server of the application store,or a relay server.

According to various embodiments, each component (e.g., a module or aprogram) of the above-described components may include a single entityor multiple entities, and some of the multiple entities may beseparately disposed in different components. According to variousembodiments, one or more of the above-described components may beomitted, or one or more other components may be added. Alternatively oradditionally, a plurality of components (e.g., modules or programs) maybe integrated into a single component. In such a case, according tovarious embodiments, the integrated component may still perform one ormore functions of each of the plurality of components in the same orsimilar manner as they are performed by a corresponding one of theplurality of components before the integration. According to variousembodiments, operations performed by the module, the program, or anothercomponent may be carried out sequentially, in parallel, repeatedly, orheuristically, or one or more of the operations may be executed in adifferent order or omitted, or one or more other operations may beadded.

While the present disclosure has been particularly shown and describedwith reference to certain embodiments thereof, it will be understood bythose of ordinary skill in the art that various changes in form anddetails may be made therein without departing from the spirit and scopeof the disclosure as defined by the appended claims and theirequivalents.

What is claimed is:
 1. An electronic device comprising: a first housing;a second housing configured to be sliding relative to the first housing;a flexible display, wherein at least part of the flexible display issupported by the second housing and a size of the flexible displayviewable from a front surface of the electronic device changes inaccordance with a sliding of the second housing; a guide memberconfigured to operatively connect at least part of the first housing andat least part of the second housing for the sliding of the secondhousing; and a conductive layer disposed between a portion of the secondhousing and the flexible display, wherein the second housing includes: afirst support portion supporting a first portion of the flexibledisplay; and a second support portion supporting a second portion of theflexible display and allowing the second portion of the flexible displayto be bent, and wherein the conductive layer is configured toelectrically connect at least a part of the flexible display and thesecond support portion.
 2. The electronic device of claim 1, wherein thesecond support portion is electrically connected to the first housing.3. The electronic device of claim 2, further comprising: a circuit boardfixedly disposed on the first housing and electrically connected to theflexible display through a flexible printed circuit board, wherein thecircuit board includes a contact portion making contact with at leastpart of the first housing and formed of a conductive material, andwherein the contact portion is configured to electrically connect thefirst housing and a ground of the circuit board.
 4. The electronicdevice of claim 2, wherein the guide member includes a first roller, asecond roller and a belt, and wherein the second support portion isdisposed to surround at least a part of the first roller and isconfigured to be electrically connected with the first housing throughcontact to the first roller.
 5. The electronic device of claim 2,wherein the guide member includes a first roller, a second roller and abelt, and wherein the belt disposed to at least partially surround thesecond roller, the belt having opposite end portions connected to thesecond housing, and wherein the second support portion is configured tobe electrically connected with the first housing through the belt. 6.The electronic device of claim 2, wherein the first housing includes aconductive area making contact with at least part of the second supportportion, and wherein the second support portion is configured to beelectrically connected with the first housing through the conductivearea.
 7. The electronic device of claim 2, wherein the second supportportion is configured to have a potential equal to the ground potentialof the flexible display through the conductive layer.
 8. The electronicdevice of claim 1, wherein the second support portion includes aplurality of protrusions forming a multi-joint structure, and whereinthe plurality of protrusions extend to a predetermined length in adirection perpendicular to the sliding direction of the second housing.9. The electronic device of claim 1, wherein the conductive layer isformed such that both sides have an adhesive force, and adheres thesecond support portion to the rear surface of the flexible display. 10.The electronic device of claim 1, wherein the conductive layer includesat least one of a conductive sheet, a conductive film, a conductivefiber, or a conductive tape.
 11. The electronic device of claim 1,further comprising: a case in which at least a portion of the firsthousing is disposed therein, wherein the second housing is slidable in afirst direction and a direction opposite to the first direction relativeto the first housing and the case, wherein the flexible display includesa first area and a second area extending from the first area, whereinthe electronic device is changed to a first state or a second stateaccording to the sliding of the second housing, wherein the first stateis a state in which the first area is exposed on the front surface ofthe electronic device and the second area is located inside the case,and wherein the second state is a state in which at least part of thesecond area, together with the first area, is exposed on the frontsurface of the electronic device as the first area slides in a firstdirection based on the first state.
 12. The electronic device of claim11, wherein the case includes a rear surface and side surfaces formed atboth ends of the rear surface, and wherein the second area slides-in orslides-out through a space between the first housing and the rearsurface of the case.
 13. The electronic device of claim 11, furthercomprising: a conductive structure disposed between at least part of thefirst housing and at least part of the second housing and configured toelectrically connect the first housing and the second housing, whereinthe conductive structure includes: a first contact member disposed onone of the first housing or the second housing; and a second contactmember and a third contact member disposed on the first housing or thesecond housing which the first contact member is not disposed on,wherein the second contact member and the third contact member arespaced apart from each other by a first distance in a sliding directionof the second housing, and wherein the first contact member isconfigured to make contact with the second contact member in the firststate to electrically connect the first housing and the second housingand is configured to make contact with the third contact member in thesecond state to electrically connect the first housing and the secondhousing.
 14. The electronic device of claim 13, wherein the firsthousing includes a first surface configured to face toward the firstsupport portion and a second surface configured to face away from thefirst surface, and wherein the first support portion and the firsthousing are configured such that a size of an area where the firstsupport portion and the first surface of the first housing face eachother varies depending on the first state and the second state.
 15. Theelectronic device of claim 14, wherein the first contact member isdisposed on the first surface of the first housing and protrudes towardthe first support portion, and wherein the second contact member and thethird contact member are disposed on one surface of the first supportportion to face the first surface of the first housing and protrudetoward the first surface of the first housing.
 16. The electronic deviceof claim 15, wherein the third contact member is spaced apart from thesecond contact member by the first distance in a direction opposite tothe first direction.
 17. The electronic device of claim 14, wherein thefirst contact member is disposed on one surface of the first supportportion and protrudes toward the first surface of the first housing, andwherein the second contact member and the third contact member aredisposed on the first surface of the first housing to face the onesurface of the first support portion and protrude toward the firstsupport portion.
 18. The electronic device of claim 17, wherein thethird contact member is spaced apart from the second contact member bythe first distance in the first direction.
 19. An electronic devicecomprising: a first housing; a second housing slidably connected to thefirst housing; a flexible display supported by the first housing and thesecond housing; a roller disposed on one side of the first housing so asto be rotatable, a belt having opposite end portions connected to thesecond housing, and a conductive layer disposed between a portion of thesecond housing and the flexible display; wherein the second housingincludes a plurality of protrusions forming a multi-joint structure, andwherein the conductive layer is configured to electrically connect atleast a part of the flexible display and the plurality of protrusions.20. The electronic device of claim 19, wherein the plurality ofprotrusions is configured to be electrically connected with the firsthousing through at least one of the roller and the belt.